JPH0476046U - - Google Patents
Info
- Publication number
- JPH0476046U JPH0476046U JP1990119868U JP11986890U JPH0476046U JP H0476046 U JPH0476046 U JP H0476046U JP 1990119868 U JP1990119868 U JP 1990119868U JP 11986890 U JP11986890 U JP 11986890U JP H0476046 U JPH0476046 U JP H0476046U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- power semiconductor
- insulating layer
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図ａ及びｂはそれぞれ、本考案の一実施例
による電力半導体装置の平面図及び側面図、第２
図ａ及びｂはそれぞれ、本考案の他の実施例によ
る電力半導体装置の平面図及び側面図、第３図ａ
及びｂはそれぞれ、従来例による電力半導体装置
の平面図及び側面図である。 １……リードフレーム、２……半導体素子、３
……電子部品、４……樹脂、９……絶縁層。
による電力半導体装置の平面図及び側面図、第２
図ａ及びｂはそれぞれ、本考案の他の実施例によ
る電力半導体装置の平面図及び側面図、第３図ａ
及びｂはそれぞれ、従来例による電力半導体装置
の平面図及び側面図である。 １……リードフレーム、２……半導体素子、３
……電子部品、４……樹脂、９……絶縁層。
Claims (1)
- 【実用新案登録請求の範囲】 リードフレーム上に半導体素子及び電子部品が
搭載され、これらが樹脂によつて樹脂封止されて
なる電力半導体装置において、 前記リードフレーム下面に絶縁層を形成し、該
絶縁層を含めて樹脂封止してなることを特徴とす
る電力半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990119868U JPH0476046U (ja) | 1990-11-15 | 1990-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990119868U JPH0476046U (ja) | 1990-11-15 | 1990-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0476046U true JPH0476046U (ja) | 1992-07-02 |
Family
ID=31867800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990119868U Pending JPH0476046U (ja) | 1990-11-15 | 1990-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0476046U (ja) |
-
1990
- 1990-11-15 JP JP1990119868U patent/JPH0476046U/ja active Pending