JPH01115251U - - Google Patents
Info
- Publication number
- JPH01115251U JPH01115251U JP1988010395U JP1039588U JPH01115251U JP H01115251 U JPH01115251 U JP H01115251U JP 1988010395 U JP1988010395 U JP 1988010395U JP 1039588 U JP1039588 U JP 1039588U JP H01115251 U JPH01115251 U JP H01115251U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- resin
- adjacent
- utility
- finish layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は、本考案に係るリードフレームの平面
図、第２図は、そのリード線の断面図、第３図は
、従来のリードフレームの平面図、第４図は、樹
脂封止方法を説明するための断面図出ある。 Ａ……樹脂封止位置、Ｂ……半田仕上層、２２
……リード線、２４……放熱板兼アイランド。
図、第２図は、そのリード線の断面図、第３図は
、従来のリードフレームの平面図、第４図は、樹
脂封止方法を説明するための断面図出ある。 Ａ……樹脂封止位置、Ｂ……半田仕上層、２２
……リード線、２４……放熱板兼アイランド。
Claims (1)
- 樹脂封止位置に隣接するリード線、放熱板等の
外部露出部に、半田仕上げ層を形成したことを特
徴とするリードフレーム。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988010395U JPH01115251U (ja) | 1988-01-28 | 1988-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988010395U JPH01115251U (ja) | 1988-01-28 | 1988-01-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01115251U true JPH01115251U (ja) | 1989-08-03 |
Family
ID=31218020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988010395U Pending JPH01115251U (ja) | 1988-01-28 | 1988-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01115251U (ja) |
-
1988
- 1988-01-28 JP JP1988010395U patent/JPH01115251U/ja active Pending