JPS61102048U - - Google Patents

Info

Publication number
JPS61102048U
JPS61102048U JP1984187130U JP18713084U JPS61102048U JP S61102048 U JPS61102048 U JP S61102048U JP 1984187130 U JP1984187130 U JP 1984187130U JP 18713084 U JP18713084 U JP 18713084U JP S61102048 U JPS61102048 U JP S61102048U
Authority
JP
Japan
Prior art keywords
semiconductor chip
heat sink
resin
thin
partially
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984187130U
Other languages
English (en)
Other versions
JPH0334913Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984187130U priority Critical patent/JPH0334913Y2/ja
Publication of JPS61102048U publication Critical patent/JPS61102048U/ja
Application granted granted Critical
Publication of JPH0334913Y2 publication Critical patent/JPH0334913Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の断面図、第２図お
よび第３図はそれぞれ従来例の一実施例および他
の従来例の断面図である。 １，１１……リードフレーム放熱板、１ａ……
放熱板凸出部、２……半導体チツプ、３，４……
封止樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チツプを搭載した放熱板全体を前記半導
    体チツプと共に樹脂で包覆してなる絶縁型樹脂封
    止半導体装置において、前記放熱板の前記半導体
    チツプ搭載部の反対側の面が部分的に凸出面とさ
    れ、この部分で前記封止樹脂が薄くないているこ
    とを特徴とする半導体装置。
JP1984187130U 1984-12-10 1984-12-10 Expired JPH0334913Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984187130U JPH0334913Y2 (ja) 1984-12-10 1984-12-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984187130U JPH0334913Y2 (ja) 1984-12-10 1984-12-10

Publications (2)

Publication Number Publication Date
JPS61102048U true JPS61102048U (ja) 1986-06-28
JPH0334913Y2 JPH0334913Y2 (ja) 1991-07-24

Family

ID=30744595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984187130U Expired JPH0334913Y2 (ja) 1984-12-10 1984-12-10

Country Status (1)

Country Link
JP (1) JPH0334913Y2 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57175448U (ja) * 1981-04-30 1982-11-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57175448U (ja) * 1981-04-30 1982-11-05

Also Published As

Publication number Publication date
JPH0334913Y2 (ja) 1991-07-24

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