JPH01116496U - - Google Patents

Info

Publication number
JPH01116496U
JPH01116496U JP1048988U JP1048988U JPH01116496U JP H01116496 U JPH01116496 U JP H01116496U JP 1048988 U JP1048988 U JP 1048988U JP 1048988 U JP1048988 U JP 1048988U JP H01116496 U JPH01116496 U JP H01116496U
Authority
JP
Japan
Prior art keywords
holes
signal line
dielectric plate
conductive path
electromagnetic interference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1048988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1048988U priority Critical patent/JPH01116496U/ja
Publication of JPH01116496U publication Critical patent/JPH01116496U/ja
Pending legal-status Critical Current

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Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Filters And Equalizers (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案による信号線電磁障害防止素子
の一実施例の構成を示す図、第2図は第1図の素
子の等価回路図、第3図は本考案による他の実施
例を示す縦断側面図である。 記号の説明:11は誘電体基板、12は貫通孔
、13は外周面電極、14は磁性体基板、15は
貫通孔、16は信号線用導電路、17は金属ケー
ス、18は樹脂モールドケース台、21はコネク
タおす部、22はコネクタめす部、23は絶縁性
基台をそれぞれあらわしている。
Fig. 1 is a diagram showing the configuration of one embodiment of the signal line electromagnetic interference prevention element according to the present invention, Fig. 2 is an equivalent circuit diagram of the element in Fig. 1, and Fig. 3 is a diagram showing another embodiment according to the present invention. FIG. Explanation of symbols: 11 is a dielectric substrate, 12 is a through hole, 13 is an outer peripheral surface electrode, 14 is a magnetic substrate, 15 is a through hole, 16 is a signal line conductive path, 17 is a metal case, 18 is a resin molded case 21 represents a male connector part, 22 represents a female connector part, and 23 represents an insulating base.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数個の貫通孔を有する誘電体板と前記誘電体
板と同ピツチの貫通孔を有する磁性体板とを組み
合わせ、前記おのおのの貫通孔に信号線用導電路
を挿通して形成されたことを特徴とする信号線電
磁障害防止素子。
It is formed by combining a dielectric plate having a plurality of through holes and a magnetic plate having through holes of the same pitch as the dielectric plate, and inserting a conductive path for a signal line into each of the through holes. Characteristic signal line electromagnetic interference prevention element.
JP1048988U 1988-01-30 1988-01-30 Pending JPH01116496U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1048988U JPH01116496U (en) 1988-01-30 1988-01-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1048988U JPH01116496U (en) 1988-01-30 1988-01-30

Publications (1)

Publication Number Publication Date
JPH01116496U true JPH01116496U (en) 1989-08-07

Family

ID=31218197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1048988U Pending JPH01116496U (en) 1988-01-30 1988-01-30

Country Status (1)

Country Link
JP (1) JPH01116496U (en)

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