JPH01125561U - - Google Patents

Info

Publication number
JPH01125561U
JPH01125561U JP1988020455U JP2045588U JPH01125561U JP H01125561 U JPH01125561 U JP H01125561U JP 1988020455 U JP1988020455 U JP 1988020455U JP 2045588 U JP2045588 U JP 2045588U JP H01125561 U JPH01125561 U JP H01125561U
Authority
JP
Japan
Prior art keywords
substrate
solid
transfer electrode
silicon nitride
receiving window
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988020455U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988020455U priority Critical patent/JPH01125561U/ja
Publication of JPH01125561U publication Critical patent/JPH01125561U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の固体撮像素子の一実施例の平
面図、第2図は第1図の本考案素子の断面図であ
る。 C……CCDチヤンネル、B……チヤンネル分
離部、P……光電変換部、W……受光窓、7……
バツシベーシヨン膜。
FIG. 1 is a plan view of an embodiment of the solid-state imaging device of the present invention, and FIG. 2 is a sectional view of the device of the present invention shown in FIG. C...CCD channel, B...channel separation section, P...photoelectric conversion section, W...light receiving window, 7...
Bathybation membrane.

Claims (1)

【実用新案登録請求の範囲】 (1) MOS構造をなす撮像基板上に該基板を保
護するための窒化シリコンからなる保護膜を形成
した固体撮像素子において、光電変換部上の上記
保護膜をエツチング除去した事を特徴とする固体
撮像素子。 (2) 半導体基体のCCDチヤンネル上に絶縁膜
を介してポリシリコン転送電極が形成された撮像
基板を備え、該基板のCCDチヤンネル上には上
記転送電極に囲まれた受光窓が局部的に配置され
、該受光窓部分を除いた上記転送電極上に窒化シ
リコン膜を形成したことを特徴とするフレームト
ランスフアー型のCCD固体撮像素子。
[Claims for Utility Model Registration] (1) In a solid-state imaging device in which a protective film made of silicon nitride is formed on an imaging substrate having a MOS structure to protect the substrate, the protective film on the photoelectric conversion section is etched. A solid-state image sensor characterized by the removal of (2) An imaging substrate is provided with a polysilicon transfer electrode formed on a CCD channel of a semiconductor substrate via an insulating film, and a light receiving window surrounded by the transfer electrode is locally arranged on the CCD channel of the substrate. A frame transfer type CCD solid-state imaging device, characterized in that a silicon nitride film is formed on the transfer electrode except for the light-receiving window portion.
JP1988020455U 1988-02-18 1988-02-18 Pending JPH01125561U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988020455U JPH01125561U (en) 1988-02-18 1988-02-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988020455U JPH01125561U (en) 1988-02-18 1988-02-18

Publications (1)

Publication Number Publication Date
JPH01125561U true JPH01125561U (en) 1989-08-28

Family

ID=31236837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988020455U Pending JPH01125561U (en) 1988-02-18 1988-02-18

Country Status (1)

Country Link
JP (1) JPH01125561U (en)

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