JPH01129965A - Target for sputtering - Google Patents

Target for sputtering

Info

Publication number
JPH01129965A
JPH01129965A JP28864987A JP28864987A JPH01129965A JP H01129965 A JPH01129965 A JP H01129965A JP 28864987 A JP28864987 A JP 28864987A JP 28864987 A JP28864987 A JP 28864987A JP H01129965 A JPH01129965 A JP H01129965A
Authority
JP
Japan
Prior art keywords
target
rare earth
alloy
sputtering
phase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28864987A
Other languages
Japanese (ja)
Inventor
Akira Aoyama
明 青山
Toshihiko Yamagishi
山岸 敏彦
Satoshi Shimokawato
下川渡 聡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP28864987A priority Critical patent/JPH01129965A/en
Publication of JPH01129965A publication Critical patent/JPH01129965A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To obtain a sputtering target causing no component distribution within a film-formation plane and reduced in magnetic permeability by constituting a casting alloy composed of a simple-substance phase of rare earth metal and an alloy phase of rare earth metal and transition metal by using Gd, Tb, Dy, Fe, Co, etc. CONSTITUTION:By sputtering a casting-alloy target having a metallic structure composed of a simple-substance phase of rare earth metal and an alloy phase of rare earth metal and transition metal, a magneto-optical recording layer consisting of an alloy of rare earth metal and transition metal is manufactured. The principal composition of the above sputtering target is regulated so that it contains at least one or more heavy rare earth metals among Gd, Tb, and Dy and at least one or more transition metals between Fe and Co. By this method, the target capable of forming a uniform film minimal in component distribution on a substrate can be obtained. Further, this target is reduced in oxygen content because it is composed of casting alloy, so that presputtering is also facilitated and, moreover, this target is reduced in magnetic permeability and, as a result, it can be applied to effective magnetron sputtering.

Description

【発明の詳細な説明】 (産業上の利用分野〕 本発明は希土類遷移金属合金スパッタリング用ターゲッ
トの組織及び組成に関する。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to the structure and composition of a rare earth transition metal alloy sputtering target.

〔従来の技術〕[Conventional technology]

希土類遷移金属系光磁気記録膜を作成するスパッタリン
グ用ターゲットは従来より鋳造法、焼結法、半溶融法な
どがある。ここでいう鋳造法とは鋳込んだ鋳塊をそのま
ま外径・表面加工にてターゲットにするものであり、焼
結法とは一度鋳込んだ鋳塊を粉砕し、焼結にてターゲッ
ト形状とするものである。又、半溶融法とは特開昭61
−99640号に示すものである。
Conventional sputtering targets for producing rare earth transition metal-based magneto-optical recording films include casting methods, sintering methods, and semi-melting methods. The casting method referred to here is a method in which the cast ingot is used as a target by external diameter and surface processing, and the sintering method is a method in which the cast ingot is crushed and sintered to create a target shape. It is something to do. In addition, the semi-melting method is described in Japanese Patent Application Laid-open No. 1983.
-99640.

しかしながら前述の焼結法は、本質的に酸素量を多く含
み(2000ppm程度)、酸化され易い希土類遷移金
属系には適していない。一方、鋳造法はTbFe系に関
しては非常に脆く、新しい組成系としてNdDyFeC
o系が注目されている。(特開昭61−16822号、
62−12941号等) 〔発明が解決しようとする問題点〕 しかしながら、前述の従来技術による鋳造法によるNd
DyFeCo、NdTbFeCo、PrDyFeCo5
PrTbFeCo系鋳造合金ターゲットでスパッタリン
グにて成膜した場合、基板面内で組成分布が生しるとい
う問題点を有する。
However, the above-mentioned sintering method is not suitable for rare earth transition metal systems which inherently contain a large amount of oxygen (approximately 2000 ppm) and are easily oxidized. On the other hand, the casting method is extremely brittle for the TbFe system, and a new composition system is NdDyFeC.
o series is attracting attention. (Unexamined Japanese Patent Publication No. 16822/1983,
62-12941, etc.) [Problems to be solved by the invention] However, the Nd
DyFeCo, NdTbFeCo, PrDyFeCo5
When a film is formed by sputtering using a PrTbFeCo-based casting alloy target, there is a problem in that a compositional distribution occurs within the plane of the substrate.

(ISMO’  87 21B−14)又、半溶融法で
作成したターゲットは基板面内で組成分布が生じにくい
という特長がある。(第10回日本応用磁気学会学術講
演概要集5 a B −7,5aB−8) しかし、半溶融法は基本的には焼結による製造であるた
め、ターゲットは完全な密状態となっておらず、大気中
に放置された場合はターゲットの表面層が酸化されてし
まい、予備スパッタリングでは表面層をクリーニングで
きないほどの酸化層となってしまう。又、半溶融法は遷
移金属単体相を含むため、ターゲットの透磁率が太き(
、マグネトロンスパッタ時には、ターゲットを薄くシな
いと十分な漏洩磁場が出ないという欠点がある。
(ISMO'87 21B-14) Furthermore, a target produced by a semi-melting method has the advantage that compositional distribution is less likely to occur within the plane of the substrate. (The 10th Japanese Society of Applied Magnetics Academic Lecture Abstracts 5aB-7, 5aB-8) However, since the semi-melting method is basically manufactured by sintering, the target is not in a completely dense state. First, if the target is left in the atmosphere, the surface layer of the target will be oxidized, and the oxidized layer will become so thick that it cannot be cleaned by preliminary sputtering. In addition, since the semi-molten method includes a single transition metal phase, the magnetic permeability of the target is large (
During magnetron sputtering, there is a drawback that sufficient leakage magnetic field cannot be generated unless the target is made thin.

そこで本発明はこのような問題点を解決するもので、そ
の目的とするところは従来の鋳造合金ターゲットがもつ
成膜面内で組成分布が生じるという欠点を克服し、さら
に半溶融法によるターゲットのもつ酸化されやすい、透
磁率が大きいという欠点を克服するターゲットを提供す
るところにある。
The present invention is intended to solve these problems, and its purpose is to overcome the drawback of the conventional cast alloy target that compositional distribution occurs within the film formation surface, and furthermore, to solve the problem of forming a target using a semi-melting method. The objective is to provide a target that overcomes the disadvantages of being easily oxidized and having high magnetic permeability.

〔問題点を解決するための手段〕[Means for solving problems]

希土類遷移金属合金からなる光磁気記録層をスパッタリ
ングにて製造する鋳造合金ターゲットにおいて、鋳造合
金ターゲット中の金属組織が、希土類金属単体相と希土
類遷移金属合金相からなることを特徴とする。
A cast alloy target for producing a magneto-optical recording layer made of a rare earth transition metal alloy by sputtering is characterized in that the metal structure in the cast alloy target consists of a rare earth metal elemental phase and a rare earth transition metal alloy phase.

〔作用〕[Effect]

従来より実験室で用いられているTMターゲット上にR
Eチップを配して成膜する複合ターゲット方式の場合、
基板面内の組成分布は鋳造合金ターゲットのそれとは逆
の傾を示す。
R on the TM target conventionally used in the laboratory.
In the case of a composite target method that uses E-chips to form a film,
The in-plane composition distribution of the substrate exhibits a slope opposite to that of the cast alloy target.

つまり、複合ターゲットの場合はターゲットの直上にな
るほどREが多く側面はどTMが多い。
In other words, in the case of a composite target, there are more REs and more TMs on the sides as the position directly above the target increases.

一方、鋳造合金ターゲットのそれはターゲットの直上に
なるほどTMが多く、側面はどREが多い。
On the other hand, in the case of a cast alloy target, there are more TMs directly above the target, and there are more REs on the sides.

これらをより詳細に見てみると、TMの飛び方は複合タ
ーゲット、鋳造合金ともほぼ同じで大きな差はなかった
。一方、REの飛び方が複合ターゲットと鋳造合金とで
大きな差があることがわかった。つまり、複合ターゲッ
トのときのREはター。
Looking at these in more detail, the flight of TM was almost the same for both composite targets and cast alloys, with no major difference. On the other hand, it was found that there is a large difference in the way RE flies between the composite target and the cast alloy. In other words, RE when using a compound target is ter.

ゲットの上方向に飛び易く、鋳造合金ターゲットのとき
のREはターゲットの横方向に飛び易いのである。つま
りRE単体相と、RE−7M合金相を適当に混存させた
鋳造合金ターゲットができれば、基板面内で組成分布が
少ない均一な成膜が可能となり、又、TM単体相がない
ため透磁率も小さくなりターゲットを厚くしても十分マ
グネトロンスパッタが可能となる。さらに鋳造合金であ
るための本来の酸素含有量も少なく、予備スパッタリン
グも非常に短くなる。
It is easy to fly upwards of the target, and RE when using a cast alloy target is easy to fly horizontally of the target. In other words, if a cast alloy target with an appropriate mixture of RE single phase and RE-7M alloy phase is created, it will be possible to form a uniform film with a small composition distribution within the substrate surface, and since there is no TM single phase, magnetic permeability This makes it possible to sufficiently perform magnetron sputtering even if the target is made thicker. Furthermore, since it is a cast alloy, the original oxygen content is low, and the preliminary sputtering period is extremely short.

〔実施例1〕 まず原料として、T byz (F eo、* COo
、+)gaat%の鋳塊を作る(以下この鋳塊をR+R
t Tz鋳塊と呼ぶ)。この鋳塊の融点は847℃と低
い。
[Example 1] First, as a raw material, T byz (F eo, *COo
,+)gaat% (hereinafter, this ingot will be referred to as R+R)
t Tz ingot). The melting point of this ingot is as low as 847°C.

そして次に(F eo、q COa、+)s*、sat
%の鋳塊を作り、平均粒径が200μm程度となる様に
この鋳塊を粉砕し粉末とする(以下この粉末をRtT8
.粉末と呼ぶ)。このRzTtt粉末の融点は1312
℃である。
And then (F eo, q COa, +)s*, sat
% of the ingot is made, and this ingot is ground into powder so that the average particle size is about 200 μm (hereinafter, this powder will be referred to as RtT8
.. powder). The melting point of this RzTtt powder is 1312
It is ℃.

これら原料、つまりR+ Rr T を鋳塊とRz T
 l ?粉末を(R+R+ Tt ): (Rt T、
?)=11.5:50の比になる様にルツボ中に投入す
る。その後ルツボを1050℃まで温度を上げる。つま
りこの1050℃の状態のときはR+RI T2鋳塊が
溶解されておりR1Tl?粉末は溶解しないまま粒末が
溶湯中に混合されている状態となる。そして、この状態
のまま鋳型に鋳込み、出来上がった鋳造合金を加工し、
4#φX6tのスパッタリングターゲットを作成した。
These raw materials, that is, R+ Rr T are combined into an ingot and Rz T
l? Powder (R+R+ Tt): (Rt T,
? )=11.5:50 into the crucible. Thereafter, the temperature of the crucible is raised to 1050°C. In other words, in this state of 1050℃, R+RI T2 ingot is melted and R1Tl? The powder remains mixed in the molten metal without being dissolved. Then, it is poured into a mold in this state, and the finished cast alloy is processed.
A sputtering target of 4#φ×6t was prepared.

このターゲットの組成はTbztF e−Ho、zCO
−1,s at%となっている。このターゲットの表面
組織の模式図を第1図に示す。1の相はTbの希土[(
R)単独相であり、2の相はTbl (Feo、、Co
o、+ )zの希土類遷移金属合金相(RITりである
。又、3の相は’rbz(F eo、q C06,1)
l?の希土類遷移金属合金相(RzT+t)である。つ
まり大きくわけて希土類単独相と希土類遷移金属合金相
の2相になっているのである。
The composition of this target is TbztFe-Ho,zCO
-1, sat%. A schematic diagram of the surface structure of this target is shown in FIG. Phase 1 is Tb rare earth [(
R) is a single phase, and the second phase is Tbl (Feo, Co
o, + ) z rare earth transition metal alloy phase (RIT). Also, the phase 3 is 'rbz (F eo, q C06,1)
l? is a rare earth transition metal alloy phase (RzT+t). In other words, there are two main phases: a rare earth single phase and a rare earth transition metal alloy phase.

このTbFeCoターゲットを第2図に示す様なスパッ
タリング装置に装着、成膜し、その磁気特性及び組成分
布を調べてみた。第2図の21がスパッタリングターゲ
ットであり、22が基板ホルダー(300φ)である。
This TbFeCo target was mounted on a sputtering apparatus as shown in FIG. 2 to form a film, and its magnetic properties and composition distribution were investigated. 21 in FIG. 2 is a sputtering target, and 22 is a substrate holder (300φ).

成膜条件はAr圧2゜5 m T o r r +初期
真空度3 x 10−’T、rr 、投入電力はDC電
源を用い1.OA 340 Vでおこなった。第3図に
本発明ターゲットを用いた基板ホルダー内組成分布及び
磁気特性分布図である。この図に示す様に組成はREが
22.0〜22.5at%で均一であり、磁気特性もH
cが14.7〜15.5K Oeで均一である。基板ホ
ルダー内にほとんどといって良いほど均一な膜が成膜で
きている。当然のこのターゲットは鋳造合金であるので
酸素量は少なく350ppmであった。
The film-forming conditions were Ar pressure 2°5 mT or r + initial vacuum level 3 x 10-'T, rr, input power using a DC power supply, and 1. It was performed at OA 340V. FIG. 3 is a diagram showing the composition distribution and magnetic property distribution in the substrate holder using the target of the present invention. As shown in this figure, the composition is uniform with RE of 22.0 to 22.5 at%, and the magnetic properties are also H
c is uniform at 14.7 to 15.5 K Oe. A nearly uniform film was formed inside the substrate holder. Naturally, since this target was a cast alloy, the amount of oxygen was small, 350 ppm.

一方、比較のために従来の製造方法でTbFeCoター
ゲットを作成した。すなわちTbFeC0全組成をT 
bztF 6BCOs at%となるようにルツボ中で
1650°Cで溶解し、そして鋳型に注湯し鋳塊を作っ
た。そしてこの鋳塊を切断、研磨し4#φX6tのTb
FeCoターゲットを作成した。第4図にこの従来の製
造方法による鋳造合金TbFeCoターゲットを用いた
基板ホルダー内組成分布及び磁気特性分布図を示す。こ
の図に示す様に組成はREが22.8〜19.8at%
で、基板ホルダー中心へい(はどREが多く、逆にホル
ダー外周へいくほどREが少なくなっている。又、磁気
特性もHcが17〜11KOeとホルダー中心へいくほ
どHcが大きくなっている。これは組成分布とも一致す
る。つまり従来の製造方法による鋳造合金TbFeCo
ターゲットはターゲットの上方向はどTM(遷移金属)
がとびやすく、横方向はどREがとびやすい特性を示し
、基板ホルダー内で組成分布を生じさせてしまう。
On the other hand, for comparison, a TbFeCo target was produced using a conventional manufacturing method. That is, the total composition of TbFeC0 is T
The melt was melted in a crucible at 1650°C to give bztF 6BCOs at%, and poured into a mold to form an ingot. Then, this ingot was cut and polished to a Tb of 4#φX6t.
A FeCo target was created. FIG. 4 shows the composition distribution and magnetic property distribution in the substrate holder using a cast alloy TbFeCo target produced by this conventional manufacturing method. As shown in this figure, the composition is 22.8 to 19.8 at% RE.
There is a lot of RE toward the center of the substrate holder, and conversely, RE decreases toward the outer periphery of the holder. Also, regarding the magnetic properties, Hc is 17 to 11 KOe, and Hc increases as you move toward the center of the holder. This is also consistent with the composition distribution, that is, the cast alloy TbFeCo produced by the conventional manufacturing method.
The target is above the target TM (transition metal)
RE is likely to jump in the lateral direction, and a composition distribution occurs within the substrate holder.

さらに半溶融法により製造したターゲットと比較するた
め、先述の本発明ターゲット組成と同様のTb!zFe
to、zcOl、@ at%の組成で半溶融法を用い4
″φX6tのターゲットを作成した。そして、これら本
発明品と半溶融品のターゲットの透磁率を測定した所、
本発明品が3であったのに対し、半溶融品は55と大き
な値であった。そして、半溶融品を先述のスパッタ装置
に装着し、放電を試みたが、放電しなかった。そこでタ
ーゲット厚みを薄くシていったところ、3.3mmtで
やっと放電する様になった。つまり半溶品は透磁率が大
きく、マグネトロン放電させるためにはターゲットを薄
くする必要がある。このことは、1枚のターゲットから
製造できる薄膜が少ないということであり、製品のコス
ト面で非常に悪いということを意味する。当然本発明品
は6 tmi tでも十分な漏洩磁場が出ており、製品
コストの点でも非常にメリットがある。ここで示した方
法以外にRt T I ?粉末を作成せず、RbTzx
粉末あるいはRITゴあるいはR,T2粉末を用いても
本発明は有効であることは確認できている。
Furthermore, in order to compare with a target manufactured by the semi-melting method, Tb! zFe
4 using a semi-melting method with a composition of to, zcOl, @at%.
A target of φX6t was prepared. Then, the magnetic permeability of the targets of the present invention and the semi-molten target was measured.
While the product of the present invention had a score of 3, the semi-molten product had a large value of 55. Then, the semi-molten product was attached to the above-mentioned sputtering device and an attempt was made to generate an electric discharge, but no electric discharge occurred. Therefore, when the target thickness was made thinner, discharge finally began to occur at 3.3 mm. In other words, semi-molten products have high magnetic permeability, and in order to generate magnetron discharge, it is necessary to make the target thin. This means that only a small number of thin films can be produced from one target, which means that the cost of the product is very poor. Naturally, the product of the present invention produces a sufficient leakage magnetic field even at 6 tmit, and is very advantageous in terms of product cost. Is there any Rt T I method other than the method shown here? RbTzx without creating powder
It has been confirmed that the present invention is effective even when powder or RIT powder or R, T2 powder is used.

〔実施例2〕 次にDyFeCoについて本発明法による効果を確認し
た。製造方法は実施例1に示す本発明品と同じであり、
まず原料としてD)’tz(Feo、eCOo、 z)
 zsat%の鋳塊を作る。この鋳塊の融点は890°
Cと低い。そして次にDy+o、s (F eo、sC
Oo、 り 89. sat%の鋳塊を作り、平均粒径
が200μm程度となる様にこの鋳塊を粉砕し粉末とす
る。このRzT+vの粉末の融点は1370°Cである
[Example 2] Next, the effect of the method of the present invention on DyFeCo was confirmed. The manufacturing method is the same as the product of the present invention shown in Example 1,
First, as raw materials D)'tz (Feo, eCOo, z)
Make an ingot of zsat%. The melting point of this ingot is 890°
C and low. And then Dy+o, s (F eo, sC
Oo, ri 89. An ingot of sat% is made, and the ingot is ground into powder so that the average particle size is about 200 μm. The melting point of this RzT+v powder is 1370°C.

これら原料、つまり鋳塊と粉末を11.5 : 50の
比になる様にルツボ中に投入する。その後ルツボを10
5=0°Cまで温度を上げる。そして鋳型に鋳込み出来
上がった鋳造合金を加工し、4″φ×6ものスパッタリ
ングターゲットを作成し実施例1と同様の成膜を試みた
所、基板ホルダー内に均一な組成、均一な磁気特性の膜
が得られた。このターゲットの酸素量は3soppm、
透磁率は3.3であった。このターゲット組成はD)’
zzFe6□、4Cols、、、at%となっている。
These raw materials, that is, the ingot and the powder, are placed in a crucible at a ratio of 11.5:50. Then add 10 crucibles
5 Raise the temperature to 0°C. Then, we processed the cast alloy that had been cast into a mold, created a 4"φ x 6 sputtering target, and tried to form a film in the same manner as in Example 1. We found that a film with a uniform composition and uniform magnetic properties was formed inside the substrate holder. was obtained.The oxygen content of this target was 3 soppm,
The magnetic permeability was 3.3. This target composition is D)'
zzFe6□, 4Cols, . . . at%.

又、金属組織は、大きくわけて希土類単独相と希土類遷
移金属合金相の2相になっていた。
Further, the metal structure was roughly divided into two phases: a rare earth single phase and a rare earth transition metal alloy phase.

〔実施例3〕 次にGdTbFeCoについて本発明法による効果を確
認した。製造方法は実施例1に示す本発明品と同じであ
り、まず原料として(Gd、、5Tbo、s)?z (
F ej、*sc Oo、os)gt、s at%の鋳
塊を作る。この鋳塊の融点は838°Cと低い。そして
次に(G d 6.s T bo、s)+o、s (F
 e o、qsCO@、0’5)aq、 sat%の鋳
塊を粉砕し粉末とする。この粉末の融点は1324°C
である。
[Example 3] Next, the effect of the method of the present invention on GdTbFeCo was confirmed. The manufacturing method is the same as the product of the present invention shown in Example 1, and first, (Gd, 5Tbo, s)? z (
F ej, *sc Oo, os)gt, sat% ingot is made. The melting point of this ingot is as low as 838°C. And then (G d 6.s T bo, s) + o, s (F
e o, qsCO@, 0'5) aq, sat% of the ingot is ground into powder. The melting point of this powder is 1324°C
It is.

これら原料、つまり鋳塊と粉末を11.5750の比に
なる様にルツボ中に投入する。その後ルツボを1050
℃まで温度を上げる。そして鋳型に鋳込み出来上がった
鋳造合金を加工し、4#φ×6tのスパッタリングター
ゲットを作成し実施例1と同様の成膜を試みた所、基板
ホルダー内に均一な組成、均一な磁気特性の膜が得られ
た。このターゲットの酸素量は360ppm、透磁率は
4.0であった。また、このターゲットの組成はGd、
These raw materials, that is, the ingot and the powder, are placed in a crucible at a ratio of 11.5750. Then the crucible is 1050
Raise the temperature to ℃. Then, we processed the finished cast alloy by casting it into a mold, created a sputtering target of 4#φ x 6t, and tried to form a film in the same manner as in Example 1. was gotten. This target had an oxygen content of 360 ppm and a magnetic permeability of 4.0. In addition, the composition of this target is Gd,
.

TbDyFeCo、tcOs、q at%となっている
。又、金属組織は大きくわけて希土類単独相と希土類遷
移金属合金相の2相になっていた。
TbDyFeCo, tcOs, q at%. Furthermore, the metal structure was roughly divided into two phases: a rare earth single phase and a rare earth transition metal alloy phase.

これら実施例1.2.3に示した組成系以外にTbDy
FeCo、DyGdFeCo、GdFeCo、GdTb
Fe、TbDyFeCo、等の組成系についても本発明
効果が存在することを確認した。
In addition to the composition system shown in Example 1.2.3, TbDy
FeCo, DyGdFeCo, GdFeCo, GdTb
It was confirmed that the effects of the present invention also exist for composition systems such as Fe, TbDyFeCo, etc.

′ 〔発明の効果〕 このように本発明を用いれば、ターゲット中の酸素量が
少ないという鋳造合金の特質を保ったまま、成膜面内で
組成分布が生じないという効果を有する。しかも、透磁
率が小さく、マグネトロンスパッタに適しており、ター
ゲット厚みも厚くすることができるため、作成した膜の
製品・コストを減らすことができる。  −
[Effects of the Invention] As described above, when the present invention is used, it is possible to maintain the characteristic of a cast alloy that the amount of oxygen in the target is small, while preventing compositional distribution within the film forming surface. Furthermore, it has low magnetic permeability and is suitable for magnetron sputtering, and the target thickness can be increased, so the product and cost of the produced film can be reduced. −

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明ターゲットの表面組織の模式図。 第2図はスパッタリング装置の概略図。 第3図は本発明のターゲットを用いた基板ホルダー内組
成分布及び磁気特性分布図。 第4図は従来の製造方法による鋳造合金ターゲットを用
いた基板ホルダー内組成分布及び磁気特性分布図。 1・・・Tbの希土類(R)単独相 2・・’Tb+  (Feo、q COo、+)zの希
土類遷移金属合金相 3=”rbz  (F e(+、9 COO,I)l?
の希土類遷移金属合金相 21・・・スパッタリングターゲット 22・・・基板ホルダー(300φ) 以上 出願人 セイコーエプソン株式会社 代理人弁理士 最上  務 他1名 −−ン 1.”;2,2^ °ニニ・。 第20
FIG. 1 is a schematic diagram of the surface structure of the target of the present invention. FIG. 2 is a schematic diagram of a sputtering device. FIG. 3 is a diagram of the composition distribution and magnetic property distribution in the substrate holder using the target of the present invention. FIG. 4 is a diagram of the composition distribution and magnetic property distribution in the substrate holder using a cast alloy target produced by the conventional manufacturing method. 1...Tb rare earth (R) single phase 2...'Tb+ (Feo, q COo, +) z rare earth transition metal alloy phase 3=”rbz (F e(+, 9 COO, I)l?
Rare earth transition metal alloy phase 21...Sputtering target 22...Substrate holder (300φ) Applicants: Seiko Epson Co., Ltd. Representative Patent Attorney Tsutomu Mogami and 1 other person 1. ”;2,2^ °Nini・. 20th

Claims (1)

【特許請求の範囲】[Claims] 希土類遷移金属合金からなる光磁気記録層をスパッタリ
ングにて製造するための鋳造合金ターゲで、前記鋳造合
金ターゲット中の金属組織が希土類金属単体相と希土類
遷移金属合金相からなるスパッタリング用ターゲットに
おいて、前記スパッタリング用ターゲットの主たる組成
が、Gd、Tb、Dyのうち少なくとも1種以上の重希
土類金属(HR)と、Fe、Coのうち少なくとも1種
類以上の遷移金属(TM)を含むことを特徴とするスパ
ッタリング用ターゲット。
A cast alloy target for manufacturing a magneto-optical recording layer made of a rare earth transition metal alloy by sputtering, wherein the metal structure in the cast alloy target is composed of a rare earth metal elemental phase and a rare earth transition metal alloy phase. The main composition of the sputtering target is characterized by containing at least one heavy rare earth metal (HR) among Gd, Tb, and Dy, and at least one transition metal (TM) among Fe and Co. Target for sputtering.
JP28864987A 1987-11-16 1987-11-16 Target for sputtering Pending JPH01129965A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28864987A JPH01129965A (en) 1987-11-16 1987-11-16 Target for sputtering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28864987A JPH01129965A (en) 1987-11-16 1987-11-16 Target for sputtering

Publications (1)

Publication Number Publication Date
JPH01129965A true JPH01129965A (en) 1989-05-23

Family

ID=17732897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28864987A Pending JPH01129965A (en) 1987-11-16 1987-11-16 Target for sputtering

Country Status (1)

Country Link
JP (1) JPH01129965A (en)

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