JPH0187547U - - Google Patents

Info

Publication number
JPH0187547U
JPH0187547U JP1987182909U JP18290987U JPH0187547U JP H0187547 U JPH0187547 U JP H0187547U JP 1987182909 U JP1987182909 U JP 1987182909U JP 18290987 U JP18290987 U JP 18290987U JP H0187547 U JPH0187547 U JP H0187547U
Authority
JP
Japan
Prior art keywords
semiconductor element
mounting structure
metal base
semiconductor
shaped groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987182909U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987182909U priority Critical patent/JPH0187547U/ja
Publication of JPH0187547U publication Critical patent/JPH0187547U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案に係る半導体素子の実装構造の
一例を示す断面図、第２図は本考案に係るＶ字溝
の溝角度を説明する図、第３図は従来の半導体素
子の実装構造の一例を示す部分断面図である。 １１……半導体素子、１２……金属ベース基板
、１３……金属ベース、１４……絶縁層、１５…
…配線金属膜、１７……溝。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属ベース基板の配線金属膜上に半導体素子を
    接合してなる半導体素子の実装構造において、熱
    発生源となる半導体素子の周辺に、金属ベースに
    達するＶ字状の溝を形成したことを特徴とする半
    導体素子の実装構造。
JP1987182909U 1987-12-02 1987-12-02 Pending JPH0187547U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987182909U JPH0187547U (ja) 1987-12-02 1987-12-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987182909U JPH0187547U (ja) 1987-12-02 1987-12-02

Publications (1)

Publication Number Publication Date
JPH0187547U true JPH0187547U (ja) 1989-06-09

Family

ID=31474349

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987182909U Pending JPH0187547U (ja) 1987-12-02 1987-12-02

Country Status (1)

Country Link
JP (1) JPH0187547U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03145748A (ja) * 1989-10-31 1991-06-20 Narumi China Corp セラミックス回路基板
JPH0472638U (ja) * 1990-10-31 1992-06-26
JP2010251457A (ja) * 2009-04-14 2010-11-04 Nissan Motor Co Ltd 半導体装置及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03145748A (ja) * 1989-10-31 1991-06-20 Narumi China Corp セラミックス回路基板
JPH0472638U (ja) * 1990-10-31 1992-06-26
JP2010251457A (ja) * 2009-04-14 2010-11-04 Nissan Motor Co Ltd 半導体装置及びその製造方法

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