JPH01143128U - - Google Patents
Info
- Publication number
- JPH01143128U JPH01143128U JP3850188U JP3850188U JPH01143128U JP H01143128 U JPH01143128 U JP H01143128U JP 3850188 U JP3850188 U JP 3850188U JP 3850188 U JP3850188 U JP 3850188U JP H01143128 U JPH01143128 U JP H01143128U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- view
- semiconductor integrated
- inner lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 3
Landscapes
- Wire Bonding (AREA)
Description
第１図はこの考案の一実施例による半導体集積
回路装置の上面図。第２図、第３図、第４図は電
極上に形成されたバンプの拡大上面図、拡大断面
図、斜視図。第５図はインナーリードと接合した
ときの斜視図、第６図は従来の半導体集積回路装
置の上面図、第７図、第８図、第９図は電極上に
形成されたバンプの拡大上面図、拡大断面図、斜
視図、第１０図はインナーリードを接合したとき
の斜視図である。
図において、１は半導体基板、２はバンプ、３
はバンプ２上の凹部、４はインナーリードを示す
。なお、図中、同一符号は同一、または相当部分
を示す。
FIG. 1 is a top view of a semiconductor integrated circuit device according to an embodiment of this invention. FIG. 2, FIG. 3, and FIG. 4 are an enlarged top view, an enlarged sectional view, and a perspective view of bumps formed on the electrodes. FIG. 5 is a perspective view of a conventional semiconductor integrated circuit device when connected to an inner lead, FIG. 6 is a top view of a conventional semiconductor integrated circuit device, and FIGS. 7, 8, and 9 are enlarged top views of bumps formed on electrodes. , an enlarged sectional view, a perspective view, and FIG. 10 are perspective views when inner leads are joined. In the figure, 1 is a semiconductor substrate, 2 is a bump, and 3 is a semiconductor substrate.
indicates a recess on the bump 2, and 4 indicates an inner lead. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
ンナーリードとの接合部分に凹部を設けたことを
特徴とする半導体集積回路装置。 A semiconductor integrated circuit device characterized in that a bump portion formed on an electrode of a semiconductor substrate is provided with a recessed portion at a joint portion with an inner lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3850188U JPH01143128U (en) | 1988-03-24 | 1988-03-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3850188U JPH01143128U (en) | 1988-03-24 | 1988-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01143128U true JPH01143128U (en) | 1989-10-02 |
Family
ID=31265045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3850188U Pending JPH01143128U (en) | 1988-03-24 | 1988-03-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01143128U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04123536U (en) * | 1991-04-26 | 1992-11-09 | サンケン電気株式会社 | electronic components |
| JP2011216918A (en) * | 2011-08-01 | 2011-10-27 | Dainippon Printing Co Ltd | Resin sealed type semiconductor device and circuit member for semiconductor device |
-
1988
- 1988-03-24 JP JP3850188U patent/JPH01143128U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04123536U (en) * | 1991-04-26 | 1992-11-09 | サンケン電気株式会社 | electronic components |
| JP2011216918A (en) * | 2011-08-01 | 2011-10-27 | Dainippon Printing Co Ltd | Resin sealed type semiconductor device and circuit member for semiconductor device |