JPH0173936U - - Google Patents

Info

Publication number
JPH0173936U
JPH0173936U JP1987170367U JP17036787U JPH0173936U JP H0173936 U JPH0173936 U JP H0173936U JP 1987170367 U JP1987170367 U JP 1987170367U JP 17036787 U JP17036787 U JP 17036787U JP H0173936 U JPH0173936 U JP H0173936U
Authority
JP
Japan
Prior art keywords
melting point
element connection
utility
registration request
low melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987170367U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987170367U priority Critical patent/JPH0173936U/ja
Publication of JPH0173936U publication Critical patent/JPH0173936U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係るハイブリツドＩＣ基板の
第１実施例を示す断面図、第２図は同平面図、第
３図は第２実施例を示す断面図、第４図はハイブ
リツドＩＣの断面図、第５図〜第７図は従来例を
示す断面図である。 Ａ…ハイブリツドＩＣ基板、１０…基板、１１
…配線リード、１１ａ…素子接続部、１２…バン
プ。 Fig. 1 is a sectional view showing a first embodiment of a hybrid IC board according to the present invention, Fig. 2 is a plan view thereof, Fig. 3 is a sectional view showing the second embodiment, and Fig. 4 is a sectional view of the hybrid IC. 5 to 7 are cross-sectional views showing conventional examples. A... Hybrid IC board, 10... Substrate, 11
... Wiring lead, 11a... Element connection part, 12... Bump.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路素子が接続される配線リードの素子接続部
に、低融点金属で成るバンプを形成したことを特
徴とする混成集積回路基板。 1. A hybrid integrated circuit board characterized in that bumps made of a low melting point metal are formed at the element connection portions of wiring leads to which circuit elements are connected.
JP1987170367U 1987-11-07 1987-11-07 Pending JPH0173936U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987170367U JPH0173936U (en) 1987-11-07 1987-11-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987170367U JPH0173936U (en) 1987-11-07 1987-11-07

Publications (1)

Publication Number Publication Date
JPH0173936U true JPH0173936U (en) 1989-05-18

Family

ID=31461243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987170367U Pending JPH0173936U (en) 1987-11-07 1987-11-07

Country Status (1)

Country Link
JP (1) JPH0173936U (en)

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