JPH01156554U - - Google Patents

Info

Publication number
JPH01156554U
JPH01156554U JP1988052361U JP5236188U JPH01156554U JP H01156554 U JPH01156554 U JP H01156554U JP 1988052361 U JP1988052361 U JP 1988052361U JP 5236188 U JP5236188 U JP 5236188U JP H01156554 U JPH01156554 U JP H01156554U
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
depression
semiconductor
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988052361U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988052361U priority Critical patent/JPH01156554U/ja
Publication of JPH01156554U publication Critical patent/JPH01156554U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図Ａ及び第１図Ｂは夫々本考案を説明する
為の正面図及び側面図、第２図はそのモールド方
法を説明する為の平面図、第３図は従来のモール
ド方法を説明する為の断面図、第４図は従来例を
説明する為の正面図、第５図及び第６図は半導体
装置の梱包方法と自動挿入方法を説明する為の正
面図及び側面図である。 ２０は半導体装置、２２はリード端子、２５は
凹型のくぼみ、２６はゲート残り、３３は金型、
３４はゲート注入孔である。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 半導体素子を樹脂モールドした半導体装置
    のゲート注入孔に対応する樹脂表面に凹型のくぼ
    みを設け、このくぼみの底面から樹脂を注入して
    封止したことを特徴とする半導体装置。 (2) 外部接続用リード端子が樹脂封止体の一側
    面から一方向にのみ導出され、その側面とは反対
    の側面に前記凹型のくぼみを設けたことを特徴と
    する請求項第１項に記載の半導体装置。
JP1988052361U 1988-04-19 1988-04-19 Pending JPH01156554U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988052361U JPH01156554U (ja) 1988-04-19 1988-04-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988052361U JPH01156554U (ja) 1988-04-19 1988-04-19

Publications (1)

Publication Number Publication Date
JPH01156554U true JPH01156554U (ja) 1989-10-27

Family

ID=31278362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988052361U Pending JPH01156554U (ja) 1988-04-19 1988-04-19

Country Status (1)

Country Link
JP (1) JPH01156554U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51137376A (en) * 1975-05-22 1976-11-27 Mitsubishi Electric Corp Manufacturing method for plastic seal type semi conductor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51137376A (en) * 1975-05-22 1976-11-27 Mitsubishi Electric Corp Manufacturing method for plastic seal type semi conductor

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