JPS6424847U - - Google Patents

Info

Publication number
JPS6424847U
JPS6424847U JP1987120870U JP12087087U JPS6424847U JP S6424847 U JPS6424847 U JP S6424847U JP 1987120870 U JP1987120870 U JP 1987120870U JP 12087087 U JP12087087 U JP 12087087U JP S6424847 U JPS6424847 U JP S6424847U
Authority
JP
Japan
Prior art keywords
semiconductor device
metal plate
utility
scope
registration request
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987120870U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987120870U priority Critical patent/JPS6424847U/ja
Publication of JPS6424847U publication Critical patent/JPS6424847U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【図面の簡単な説明】
第１図は本考案の半導体装置の断面図。第２図
は従来の半導体装置の断面図。 １……基板、２……金属板、３……半導体チツ
プ、４……モールド。

Claims (1)

    【実用新案登録請求の範囲】
  1. 金属板を、具備することを特徴とする半導体装
    置。
JP1987120870U 1987-08-06 1987-08-06 Pending JPS6424847U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987120870U JPS6424847U (ja) 1987-08-06 1987-08-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987120870U JPS6424847U (ja) 1987-08-06 1987-08-06

Publications (1)

Publication Number Publication Date
JPS6424847U true JPS6424847U (ja) 1989-02-10

Family

ID=31367368

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987120870U Pending JPS6424847U (ja) 1987-08-06 1987-08-06

Country Status (1)

Country Link
JP (1) JPS6424847U (ja)

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