JPH01160841U - - Google Patents
Info
- Publication number
- JPH01160841U JPH01160841U JP1988049666U JP4966688U JPH01160841U JP H01160841 U JPH01160841 U JP H01160841U JP 1988049666 U JP1988049666 U JP 1988049666U JP 4966688 U JP4966688 U JP 4966688U JP H01160841 U JPH01160841 U JP H01160841U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- stitch portion
- package
- semiconductor device
- stitch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
第１図のＡ―Ａ線に沿う断面図、第３図は本考案
の他の実施例の平面図である。 １…パツケージベース、２…アイランド部、３
…ステツチ部、４…外部リード端子、５…逃げ部
、６…半導体チツプ、７…電極パツド、８…金属
ワイヤ。
第１図のＡ―Ａ線に沿う断面図、第３図は本考案
の他の実施例の平面図である。 １…パツケージベース、２…アイランド部、３
…ステツチ部、４…外部リード端子、５…逃げ部
、６…半導体チツプ、７…電極パツド、８…金属
ワイヤ。
Claims (1)
- 半導体チツプを搭載するアイランド部と、この
半導体チツプと略同じ高さで前記アイランド部の
周囲に設けたステツチ部と、このステツチ部の上
に形成して金属ワイヤにより前記半導体チツプに
電気接続される外部リード端子とを備える半導体
装置用パツケージにおいて、前記ステツチ部は半
導体チツプとの間隔が可及的に小さくなるように
構成するとともに、ステツチ部の少なくとも２つ
の対角位置に外側に向けて凹設した逃げ部を形成
したことを特徴とする半導体装置用パツケージ。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988049666U JPH01160841U (ja) | 1988-04-13 | 1988-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988049666U JPH01160841U (ja) | 1988-04-13 | 1988-04-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01160841U true JPH01160841U (ja) | 1989-11-08 |
Family
ID=31275753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988049666U Pending JPH01160841U (ja) | 1988-04-13 | 1988-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160841U (ja) |
-
1988
- 1988-04-13 JP JP1988049666U patent/JPH01160841U/ja active Pending