JPH01176992U - - Google Patents

Info

Publication number
JPH01176992U
JPH01176992U JP1988074189U JP7418988U JPH01176992U JP H01176992 U JPH01176992 U JP H01176992U JP 1988074189 U JP1988074189 U JP 1988074189U JP 7418988 U JP7418988 U JP 7418988U JP H01176992 U JPH01176992 U JP H01176992U
Authority
JP
Japan
Prior art keywords
circuit board
surface plate
ventilation hole
heat
compressed air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988074189U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988074189U priority Critical patent/JPH01176992U/ja
Publication of JPH01176992U publication Critical patent/JPH01176992U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案による一実施例の側断面図、第
２図は従来技術による側断面図である。 図において、１は回路基板、２は放熱器、２ａ
は通気孔、２ｂは表面板、２ｂ―１は搭載部、３
は絶縁層、４は回路パターン、５は発熱部品、６
は冷却用圧縮空気を示す。 FIG. 1 is a side sectional view of an embodiment of the present invention, and FIG. 2 is a side sectional view of a conventional technique. In the figure, 1 is a circuit board, 2 is a heat sink, 2a
is the ventilation hole, 2b is the surface plate, 2b-1 is the mounting part, 3
is an insulating layer, 4 is a circuit pattern, 5 is a heat generating component, 6
indicates compressed air for cooling.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ハネカム構造の通気孔２ａを有する高熱伝導性
金属からなる放熱器２の表面板２ｂに回路パター
ン４を形成してなる回路基板１の前記表面板２ｂ
に発熱部品５を搭載し、上記通気孔２ａに冷却用
圧縮空気６を通し放熱することを特徴とする回路
基板の放熱構造。 The surface plate 2b of the circuit board 1 is formed by forming the circuit pattern 4 on the surface plate 2b of the radiator 2 made of a highly thermally conductive metal and having a honeycomb structure ventilation hole 2a.
A heat radiation structure for a circuit board, characterized in that a heat generating component 5 is mounted on the circuit board, and the heat is radiated by passing compressed air 6 for cooling through the ventilation hole 2a.
JP1988074189U 1988-06-02 1988-06-02 Pending JPH01176992U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988074189U JPH01176992U (en) 1988-06-02 1988-06-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988074189U JPH01176992U (en) 1988-06-02 1988-06-02

Publications (1)

Publication Number Publication Date
JPH01176992U true JPH01176992U (en) 1989-12-18

Family

ID=31299308

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988074189U Pending JPH01176992U (en) 1988-06-02 1988-06-02

Country Status (1)

Country Link
JP (1) JPH01176992U (en)

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