JPH01181593A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH01181593A JPH01181593A JP337888A JP337888A JPH01181593A JP H01181593 A JPH01181593 A JP H01181593A JP 337888 A JP337888 A JP 337888A JP 337888 A JP337888 A JP 337888A JP H01181593 A JPH01181593 A JP H01181593A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- gold
- solder
- plated
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing of the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は接触端子部に金めつきを施した印刷配線板の
製造方法の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an improvement in a method of manufacturing a printed wiring board in which contact terminal portions are plated with gold.
接触端子部に金めつきを施した印刷配線板に半田めっき
、半田コーチ、インクにより所定パターンを半田で被膜
する場合、金めつき部をテープにより第２図に示すよう
に、（ａ）の工程において基板（１）に銅箔（２）によ
り所定パターンが形成され、接触端子部には金めつき（
３）が施されている。（ｂ）の工程において接触端子部
の金めつき（３）の上よりテープ（７）によりマスフす
る。（Ｃ）の工程で半田めっき、半田コーティングによ
る半田の被膜（６）を行なう。（ｃｌ）の工程でテープ
を取シ除き、金めつきを露出させることにより完了する
。When coating a printed wiring board with gold plating on the contact terminals in a predetermined pattern using solder plating, solder coach, or ink, the gold-plated parts are covered with tape as shown in Figure 2 (a). In the process, a predetermined pattern is formed on the board (1) using copper foil (2), and the contact terminals are plated with gold (
3) has been applied. In step (b), the gold plating (3) of the contact terminal portion is covered with tape (7). In step (C), a solder coating (6) is performed by solder plating and solder coating. In step (cl), the tape is removed and the gold plating is exposed to complete the process.
上記のような従来の金めつき部のマスク方法においては
、第３図のように、テープ（７）と接触端子部＋２１
、 ＋３）の間は往々にして空隙（８）を生じ、この空
隙より半田のめつき液や溶融半田が入り込み、金めつき
部に付着するという課題があった。In the conventional method of masking the gold-plated part as described above, as shown in Fig. 3, the tape (7) and the contact terminal part +21
, +3) often creates a void (8), and there is a problem in that solder plating liquid and molten solder enter through this void and adhere to the gold-plated portion.
この発明は上記のような課題を解消するためになされた
もので、半田被膜時の金めつきを保護することを目的と
する。This invention was made to solve the above-mentioned problems, and its purpose is to protect gold plating during solder coating.
この発明は印刷配線板の金めつきδれた接触端子部を半
田めっき、半田コーティングによる半田被膜時にマスク
して保護する方法で、金めつき部の両端を厚み０．１２
〜Ｑ、２ｍ＋程度のクラフトテープによりマスフし、プ
リント用スキージによりクラフトテープの上よプ耐熱イ
ンクを塗布することを特徴としたものである。This invention is a method of protecting the gold-plated contact terminal portions of a printed wiring board by masking and protecting them during the solder coating by solder plating and solder coating.
~Q, The feature is that it is masked with a craft tape of about 2m+, and heat-resistant ink is applied on top of the craft tape using a printing squeegee.
半田被膜より保護する金めつき部の両端を厚み０．１２
〜０．２１１１程度のクラフトテープでマスクする。Thickness 0.12 on both ends of the gold plated part to protect from the solder film
Mask with craft tape of ~0.2111.
金めつき部とクラフトテープの上よりプリント用スキー
ジで耐熱インクを１回塗布することによりフラフトテー
プの厚み分の耐熱インクをスクリーンを用いずに塗布す
ることができ、′ｓ３図の窒隙（８）を生じることが無
い。By applying heat-resistant ink once with a printing squeegee over the gold-plated area and craft tape, heat-resistant ink for the thickness of the craft tape can be applied without using a screen, and the nitrogen gap (8 ) will not occur.
第１図はこの発明の実施例である印刷配線板の接触端子
部に金めつきを施した後、半田めっき。FIG. 1 shows a printed wiring board according to an embodiment of the present invention, in which the contact terminals are gold plated and then solder plated.
半田コーティングにより所定パターンを半田で被膜する
製造工程を示すものである。This figure shows a manufacturing process in which a predetermined pattern is coated with solder by solder coating.
第１図（ａ）の工程は基板（１１に銅箔（２）により所
定パターンが形成され、接触端子部には金めつき（３）
が残されている。The process shown in Fig. 1(a) is to form a predetermined pattern on the board (11) with copper foil (2), and gold plating (3) on the contact terminals.
is left behind.
第１図（１））の工程は所定寸法の接触端子部の両端に
厚み０．１２〜０．２ｆｌ程度のクラフトテープ（４）
によりマスクする。クラフトテープはテープ厚みが南れ
ば安価なもので良い。The process shown in Fig. 1 (1)) involves attaching craft tape (4) with a thickness of about 0.12 to 0.2 fl to both ends of the contact terminal part of a predetermined size.
Mask by. As long as the tape is thick enough, you can use cheap craft tape.
第１図（Ｃ）の工程はスクリーンプリントで用いられて
いるウレタンスキージにより、クラフトテープの上より
耐熱インク（５）を１回塗布した状態を示している。耐
熱インクは後で取除くため、剥離可能なシリコン系イン
クを用いる。The step in FIG. 1(C) shows a state in which heat-resistant ink (5) is applied once over the craft tape using a urethane squeegee used in screen printing. Since the heat-resistant ink can be removed later, a removable silicone-based ink is used.
第１図（ｄ）の工程はクラフトテープを取シ、金めつき
上を耐熱インクで保換し、半田めっき、半田コーティン
グにより半田被膜（６）を所定パターンに施す。In the process shown in FIG. 1(d), the craft tape is removed, the gold-plated surface is preserved with heat-resistant ink, and a solder film (6) is applied in a predetermined pattern by solder plating and solder coating.
ｆＪ１図（ｅ）の工程で、耐熱インクを取除き、所望の
曾めっきされた接触端子部が有る印刷配線板が得られる
。In the process shown in Fig. fJ1 (e), the heat-resistant ink is removed, and a printed wiring board with the desired fully plated contact terminal portions is obtained.
以上のように、この発明によれば、金めつき部の両端を
クラフトテープといった安価なテープでマスクし、この
上よりスクリーン用スキージを用いて耐熱インクを１回
塗布することにより、簡単′ に半田被膜より金めつき
部を保護することができ。As described above, according to the present invention, both ends of the gold-plated part are masked with an inexpensive tape such as craft tape, and heat-resistant ink is applied once over the mask using a screen squeegee. It can protect the gold plated parts better than the solder film.
安定した信頼性の高い接触端子部が得られる。A stable and highly reliable contact terminal section can be obtained.
第１図はこの発明の実施例である印刷配線板の接触端子
部に金めつきを施した後、半田めっき。
半田コーティングにより所定パターンを半田被膜する製
造工程を示す図、第２図は従来のテープによるマスクで
の半田被膜をする製造工程を示す図。
第３図は従来の製造方法における課題を説明するための
図である。
図中、（１）は基板、（２）は鋼箔のパターン、（３）
は接触端子の金めつき部、（４）はクラフトテープ、（
５）は耐熱インク、（６）は半田被膜、（７）は耐薬品
、耐熱性のテープ、（８）はテープとパターン間にでき
る胞隙である。
なお２図中、同一あるいは相当部分には同一符号を付し
て示しである。FIG. 1 shows a printed wiring board according to an embodiment of the present invention, in which the contact terminals are gold plated and then solder plated. FIG. 2 is a diagram illustrating a manufacturing process in which a predetermined pattern is coated with solder by solder coating, and FIG. 2 is a diagram showing a manufacturing process in which a solder coating is applied using a mask using a conventional tape. FIG. 3 is a diagram for explaining problems in the conventional manufacturing method. In the figure, (1) is the substrate, (2) is the steel foil pattern, and (3)
is the gold-plated part of the contact terminal, (4) is the craft tape, (
5) is a heat-resistant ink, (6) is a solder coating, (7) is a chemical-resistant and heat-resistant tape, and (8) is a gap formed between the tape and the pattern. In FIG. 2, the same or corresponding parts are designated by the same reference numerals.
Claims (1)
つき，半田コーティングにより所定パターンを半田で被
膜する方法において，上記金めつき部をテープによりマ
スクし，そのテープ上よりプリント用スキージを用いて
，耐熱性インクを塗布した後，上記テープを取り除くこ
とにより，上記金めつき部を半田より保護することを特
徴とする印刷配線板の製造方法。In this method, after gold plating is applied to the contact terminals of a printed wiring board, a predetermined pattern is coated with solder by solder plating or solder coating. A method for manufacturing a printed wiring board, characterized in that the gold-plated portion is protected from solder by removing the tape after applying heat-resistant ink using a squeegee.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP337888A JPH01181593A (en) | 1988-01-11 | 1988-01-11 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP337888A JPH01181593A (en) | 1988-01-11 | 1988-01-11 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01181593A true JPH01181593A (en) | 1989-07-19 |
Family
ID=11555691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP337888A Pending JPH01181593A (en) | 1988-01-11 | 1988-01-11 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01181593A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07162131A (en) * | 1993-12-13 | 1995-06-23 | Nec Corp | Manufacture of printed wiring board |
-
1988
- 1988-01-11 JP JP337888A patent/JPH01181593A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07162131A (en) * | 1993-12-13 | 1995-06-23 | Nec Corp | Manufacture of printed wiring board |
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