JPH0120531B2 - - Google Patents

Info

Publication number
JPH0120531B2
JPH0120531B2 JP58174105A JP17410583A JPH0120531B2 JP H0120531 B2 JPH0120531 B2 JP H0120531B2 JP 58174105 A JP58174105 A JP 58174105A JP 17410583 A JP17410583 A JP 17410583A JP H0120531 B2 JPH0120531 B2 JP H0120531B2
Authority
JP
Japan
Prior art keywords
heat
resin film
forming
silicon
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58174105A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6066437A (ja
Inventor
Ken Ogura
Yasushi Nakabo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP58174105A priority Critical patent/JPS6066437A/ja
Priority to US06/581,365 priority patent/US4528216A/en
Publication of JPS6066437A publication Critical patent/JPS6066437A/ja
Publication of JPH0120531B2 publication Critical patent/JPH0120531B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP58174105A 1983-02-24 1983-09-22 耐熱樹脂膜の形成方法 Granted JPS6066437A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP58174105A JPS6066437A (ja) 1983-09-22 1983-09-22 耐熱樹脂膜の形成方法
US06/581,365 US4528216A (en) 1983-02-24 1984-02-17 Process for forming heat-resistant resin films of polyimide and organosilicic reactants

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58174105A JPS6066437A (ja) 1983-09-22 1983-09-22 耐熱樹脂膜の形成方法

Publications (2)

Publication Number Publication Date
JPS6066437A JPS6066437A (ja) 1985-04-16
JPH0120531B2 true JPH0120531B2 (de) 1989-04-17

Family

ID=15972730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58174105A Granted JPS6066437A (ja) 1983-02-24 1983-09-22 耐熱樹脂膜の形成方法

Country Status (1)

Country Link
JP (1) JPS6066437A (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07116360B2 (ja) * 1986-06-02 1995-12-13 東レ株式会社 ポリイミドコ−テイング剤組成物
JPH0834202B2 (ja) * 1986-06-11 1996-03-29 東レ株式会社 半導体素子の製造方法
JPH07116407B2 (ja) * 1986-07-08 1995-12-13 東レ株式会社 半導体素子のパツシベ−シヨン方法
JP2001288362A (ja) * 2000-04-05 2001-10-16 Hitachi Ltd 耐熱性樹脂組成物及びその製造方法

Also Published As

Publication number Publication date
JPS6066437A (ja) 1985-04-16

Similar Documents

Publication Publication Date Title
EP0517475B1 (de) Verfahren zur Beschichtung eines Substrates mit einem Kiesel-Vorprodukt
CA2051174C (en) Polyimide adhesion on reactive metals
JPH04224824A (ja) 低ｔｃｅポリイミド
US6074695A (en) Composition and process for forming electrically insulating thin films
JPH0410418A (ja) 半導体装置
EP0869515B1 (de) Zusammensetzung und Verfahren zum Bilden von elektrisch isolierenden Dünnschichten
JPH0120531B2 (de)
JP2002534804A (ja) 有機ヒドリドシロキサン樹脂による誘電フィルム
JP2000340651A (ja) 低誘電率膜の製造法
US4528216A (en) Process for forming heat-resistant resin films of polyimide and organosilicic reactants
US5569731A (en) N,N' disubstituted perylene diamide
JPH0120532B2 (de)
JPS62261149A (ja) 半導体装置の製造方法
JP2743366B2 (ja) 樹脂層間膜を用いた多層配線構造体の製造方法
Matsuoka et al. Ester‐type photosensitive polyimide precursor with low thermal expansion coefficient
JPH0216007B2 (de)
JPS61273806A (ja) 絶縁被覆電線
JP2979558B2 (ja) 半導体装置の多層配線層間絶縁膜の形成方法
JPH10144672A (ja) 半導体装置の絶縁膜形成方法及び絶縁膜形成材料
JPH1131690A (ja) 多孔質膜の形成方法
JP2000021872A (ja) 低誘電率樹脂組成物、低誘電率絶縁膜形成方法および半導体装置の製造方法
JPS59155137A (ja) 耐熱樹脂膜の形成方法
JPH11209624A (ja) フッ素樹脂と無機・有機ハイブリッドの複合体およびその製造方法
JPH0439371A (ja) 絶縁膜形成方法および絶縁膜を有する半導体装置
JPH02192729A (ja) 絶縁層の製造方法