JPH0120532B2 - - Google Patents

Info

Publication number
JPH0120532B2
JPH0120532B2 JP58174106A JP17410683A JPH0120532B2 JP H0120532 B2 JPH0120532 B2 JP H0120532B2 JP 58174106 A JP58174106 A JP 58174106A JP 17410683 A JP17410683 A JP 17410683A JP H0120532 B2 JPH0120532 B2 JP H0120532B2
Authority
JP
Japan
Prior art keywords
heat
resin film
resin
silicon
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58174106A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6066438A (ja
Inventor
Ken Ogura
Yasushi Nakabo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP58174106A priority Critical patent/JPS6066438A/ja
Priority to US06/581,365 priority patent/US4528216A/en
Publication of JPS6066438A publication Critical patent/JPS6066438A/ja
Publication of JPH0120532B2 publication Critical patent/JPH0120532B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP58174106A 1983-02-24 1983-09-22 耐熱樹脂膜の形成方法 Granted JPS6066438A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP58174106A JPS6066438A (ja) 1983-09-22 1983-09-22 耐熱樹脂膜の形成方法
US06/581,365 US4528216A (en) 1983-02-24 1984-02-17 Process for forming heat-resistant resin films of polyimide and organosilicic reactants

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58174106A JPS6066438A (ja) 1983-09-22 1983-09-22 耐熱樹脂膜の形成方法

Publications (2)

Publication Number Publication Date
JPS6066438A JPS6066438A (ja) 1985-04-16
JPH0120532B2 true JPH0120532B2 (de) 1989-04-17

Family

ID=15972749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58174106A Granted JPS6066438A (ja) 1983-02-24 1983-09-22 耐熱樹脂膜の形成方法

Country Status (1)

Country Link
JP (1) JPS6066438A (de)

Also Published As

Publication number Publication date
JPS6066438A (ja) 1985-04-16

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