JPS6066437A - 耐熱樹脂膜の形成方法 - Google Patents

耐熱樹脂膜の形成方法

Info

Publication number
JPS6066437A
JPS6066437A JP58174105A JP17410583A JPS6066437A JP S6066437 A JPS6066437 A JP S6066437A JP 58174105 A JP58174105 A JP 58174105A JP 17410583 A JP17410583 A JP 17410583A JP S6066437 A JPS6066437 A JP S6066437A
Authority
JP
Japan
Prior art keywords
heat
resin film
solution
silicon
resistant resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58174105A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0120531B2 (de
Inventor
Ken Ogura
謙 小椋
Yasushi Nakabo
中坊　康司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP58174105A priority Critical patent/JPS6066437A/ja
Priority to US06/581,365 priority patent/US4528216A/en
Publication of JPS6066437A publication Critical patent/JPS6066437A/ja
Publication of JPH0120531B2 publication Critical patent/JPH0120531B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP58174105A 1983-02-24 1983-09-22 耐熱樹脂膜の形成方法 Granted JPS6066437A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP58174105A JPS6066437A (ja) 1983-09-22 1983-09-22 耐熱樹脂膜の形成方法
US06/581,365 US4528216A (en) 1983-02-24 1984-02-17 Process for forming heat-resistant resin films of polyimide and organosilicic reactants

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58174105A JPS6066437A (ja) 1983-09-22 1983-09-22 耐熱樹脂膜の形成方法

Publications (2)

Publication Number Publication Date
JPS6066437A true JPS6066437A (ja) 1985-04-16
JPH0120531B2 JPH0120531B2 (de) 1989-04-17

Family

ID=15972730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58174105A Granted JPS6066437A (ja) 1983-02-24 1983-09-22 耐熱樹脂膜の形成方法

Country Status (1)

Country Link
JP (1) JPS6066437A (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62283153A (ja) * 1986-06-02 1987-12-09 Toray Ind Inc ポリイミドコ−テイング剤組成物
JPS62291119A (ja) * 1986-06-11 1987-12-17 Toray Ind Inc 半導体素子の製造方法
JPS6315424A (ja) * 1986-07-08 1988-01-22 Toray Ind Inc 半導体素子のパツシベ−シヨン方法
EP1146074A3 (de) * 2000-04-05 2002-05-02 Hitachi, Ltd. Hitzebeständige Harzzusammensetzung und Verfahren zu ihrer Herstellung

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62283153A (ja) * 1986-06-02 1987-12-09 Toray Ind Inc ポリイミドコ−テイング剤組成物
JPS62291119A (ja) * 1986-06-11 1987-12-17 Toray Ind Inc 半導体素子の製造方法
JPS6315424A (ja) * 1986-07-08 1988-01-22 Toray Ind Inc 半導体素子のパツシベ−シヨン方法
EP1146074A3 (de) * 2000-04-05 2002-05-02 Hitachi, Ltd. Hitzebeständige Harzzusammensetzung und Verfahren zu ihrer Herstellung

Also Published As

Publication number Publication date
JPH0120531B2 (de) 1989-04-17

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