JPH01302728A - 樹脂封止型半導体装置の製造方法 - Google Patents

樹脂封止型半導体装置の製造方法

Info

Publication number
JPH01302728A
JPH01302728A JP1089421A JP8942189A JPH01302728A JP H01302728 A JPH01302728 A JP H01302728A JP 1089421 A JP1089421 A JP 1089421A JP 8942189 A JP8942189 A JP 8942189A JP H01302728 A JPH01302728 A JP H01302728A
Authority
JP
Japan
Prior art keywords
resin
support plate
coating
resin coating
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1089421A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0432538B2 (da
Inventor
Minehide Totokawa
都外川　峯秀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP1089421A priority Critical patent/JPH01302728A/ja
Publication of JPH01302728A publication Critical patent/JPH01302728A/ja
Publication of JPH0432538B2 publication Critical patent/JPH0432538B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1089421A 1989-04-07 1989-04-07 樹脂封止型半導体装置の製造方法 Granted JPH01302728A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1089421A JPH01302728A (ja) 1989-04-07 1989-04-07 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1089421A JPH01302728A (ja) 1989-04-07 1989-04-07 樹脂封止型半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP59114018A Division JPS60257529A (ja) 1984-06-04 1984-06-04 樹脂封止型半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP3124888A Division JPH065687B2 (ja) 1991-04-26 1991-04-26 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH01302728A true JPH01302728A (ja) 1989-12-06
JPH0432538B2 JPH0432538B2 (da) 1992-05-29

Family

ID=13970195

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1089421A Granted JPH01302728A (ja) 1989-04-07 1989-04-07 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPH01302728A (da)

Also Published As

Publication number Publication date
JPH0432538B2 (da) 1992-05-29

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