JPH0432538B2 - - Google Patents

Info

Publication number
JPH0432538B2
JPH0432538B2 JP1089421A JP8942189A JPH0432538B2 JP H0432538 B2 JPH0432538 B2 JP H0432538B2 JP 1089421 A JP1089421 A JP 1089421A JP 8942189 A JP8942189 A JP 8942189A JP H0432538 B2 JPH0432538 B2 JP H0432538B2
Authority
JP
Japan
Prior art keywords
resin
support plate
covering portion
chip
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1089421A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01302728A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1089421A priority Critical patent/JPH01302728A/ja
Publication of JPH01302728A publication Critical patent/JPH01302728A/ja
Publication of JPH0432538B2 publication Critical patent/JPH0432538B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1089421A 1989-04-07 1989-04-07 樹脂封止型半導体装置の製造方法 Granted JPH01302728A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1089421A JPH01302728A (ja) 1989-04-07 1989-04-07 樹脂封止型半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1089421A JPH01302728A (ja) 1989-04-07 1989-04-07 樹脂封止型半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP59114018A Division JPS60257529A (ja) 1984-06-04 1984-06-04 樹脂封止型半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP3124888A Division JPH065687B2 (ja) 1991-04-26 1991-04-26 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH01302728A JPH01302728A (ja) 1989-12-06
JPH0432538B2 true JPH0432538B2 (da) 1992-05-29

Family

ID=13970195

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1089421A Granted JPH01302728A (ja) 1989-04-07 1989-04-07 樹脂封止型半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPH01302728A (da)

Also Published As

Publication number Publication date
JPH01302728A (ja) 1989-12-06

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