JPH01303729A - 混成集積回路における半導体チップの樹脂モールド方法 - Google Patents

混成集積回路における半導体チップの樹脂モールド方法

Info

Publication number
JPH01303729A
JPH01303729A JP63132640A JP13264088A JPH01303729A JP H01303729 A JPH01303729 A JP H01303729A JP 63132640 A JP63132640 A JP 63132640A JP 13264088 A JP13264088 A JP 13264088A JP H01303729 A JPH01303729 A JP H01303729A
Authority
JP
Japan
Prior art keywords
resin
elastic body
hole
semiconductor chip
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63132640A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0532903B2 (cs
Inventor
Toru Sudo
徹 須藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GOYO DENSHI KOGYO KK
Original Assignee
GOYO DENSHI KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GOYO DENSHI KOGYO KK filed Critical GOYO DENSHI KOGYO KK
Priority to JP63132640A priority Critical patent/JPH01303729A/ja
Publication of JPH01303729A publication Critical patent/JPH01303729A/ja
Publication of JPH0532903B2 publication Critical patent/JPH0532903B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP63132640A 1988-06-01 1988-06-01 混成集積回路における半導体チップの樹脂モールド方法 Granted JPH01303729A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63132640A JPH01303729A (ja) 1988-06-01 1988-06-01 混成集積回路における半導体チップの樹脂モールド方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63132640A JPH01303729A (ja) 1988-06-01 1988-06-01 混成集積回路における半導体チップの樹脂モールド方法

Publications (2)

Publication Number Publication Date
JPH01303729A true JPH01303729A (ja) 1989-12-07
JPH0532903B2 JPH0532903B2 (cs) 1993-05-18

Family

ID=15086056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63132640A Granted JPH01303729A (ja) 1988-06-01 1988-06-01 混成集積回路における半導体チップの樹脂モールド方法

Country Status (1)

Country Link
JP (1) JPH01303729A (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0182543B1 (ko) * 1995-04-07 1999-03-20 김광호 전자렌지의 조명장치 및 그 제어방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS548680U (cs) * 1977-06-21 1979-01-20
JPS6352428A (ja) * 1986-08-22 1988-03-05 Olympus Optical Co Ltd 半導体素子の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS548680U (cs) * 1977-06-21 1979-01-20
JPS6352428A (ja) * 1986-08-22 1988-03-05 Olympus Optical Co Ltd 半導体素子の製造方法

Also Published As

Publication number Publication date
JPH0532903B2 (cs) 1993-05-18

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