JPH0532903B2 - - Google Patents

Info

Publication number
JPH0532903B2
JPH0532903B2 JP63132640A JP13264088A JPH0532903B2 JP H0532903 B2 JPH0532903 B2 JP H0532903B2 JP 63132640 A JP63132640 A JP 63132640A JP 13264088 A JP13264088 A JP 13264088A JP H0532903 B2 JPH0532903 B2 JP H0532903B2
Authority
JP
Japan
Prior art keywords
hole
resin
semiconductor chip
circuit board
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63132640A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01303729A (ja
Inventor
Tooru Sudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GOYO DENSHI KOGYO KK
Original Assignee
GOYO DENSHI KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GOYO DENSHI KOGYO KK filed Critical GOYO DENSHI KOGYO KK
Priority to JP63132640A priority Critical patent/JPH01303729A/ja
Publication of JPH01303729A publication Critical patent/JPH01303729A/ja
Publication of JPH0532903B2 publication Critical patent/JPH0532903B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP63132640A 1988-06-01 1988-06-01 混成集積回路における半導体チップの樹脂モールド方法 Granted JPH01303729A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63132640A JPH01303729A (ja) 1988-06-01 1988-06-01 混成集積回路における半導体チップの樹脂モールド方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63132640A JPH01303729A (ja) 1988-06-01 1988-06-01 混成集積回路における半導体チップの樹脂モールド方法

Publications (2)

Publication Number Publication Date
JPH01303729A JPH01303729A (ja) 1989-12-07
JPH0532903B2 true JPH0532903B2 (cs) 1993-05-18

Family

ID=15086056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63132640A Granted JPH01303729A (ja) 1988-06-01 1988-06-01 混成集積回路における半導体チップの樹脂モールド方法

Country Status (1)

Country Link
JP (1) JPH01303729A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08327071A (ja) * 1995-04-07 1996-12-10 Samsung Electronics Co Ltd 電子レンジの照明装置およびその制御方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS548680U (cs) * 1977-06-21 1979-01-20
JPS6352428A (ja) * 1986-08-22 1988-03-05 Olympus Optical Co Ltd 半導体素子の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08327071A (ja) * 1995-04-07 1996-12-10 Samsung Electronics Co Ltd 電子レンジの照明装置およびその制御方法

Also Published As

Publication number Publication date
JPH01303729A (ja) 1989-12-07

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