JPH01316960A - Package for microwave diode - Google Patents

Abstract

PURPOSE:To improve microwave characteristics by a method wherein regions conventionally connected by means of thin films are connected by means of through-holes for reducing inductance and lowering resistance. CONSTITUTION:An anode electrode pad 4 and an anode lead 7 are connected to each other by two through-holes 11 and a cathode electrode pad 3 and a cathode lead 8 are connected by three through-holes 11. This design reduces inductance and lowers resistance between the leads 7, 8 and the electrodes of a diode 6, which improves microwave characteristics.

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a package for a microwave diode,
In particular, it relates to improvement of microwave characteristics and yield.

[Conventional technology]

Fig. 4 shows a top view of a conventional microwave diode package with the cap removed, and Fig. 5 shows a side sectional view of the conventional microwave diode package with the cap removed. Base dielectric, 2 side dielectric, 3 power node electrode pad, 4 anode electrode pad, 5 gold wire, 6 diode chip,
7 is an anode lead, 8 is a cathode lead, and 10 is a silver solder.

Next, the structure of a conventional micro-wave diode package will be explained.

Conductors that will become the cathode electrode pad 3 and the anode electrode pad 4 are applied to both sides and sides of the base dielectric 1, and the side dielectric 2 is placed on one side of the base dielectric 1 and sintered at high temperature. Next, the anode lead 7 and the cathode lead 8 are soldered with silver to the lower surface of the base dielectric 1 using a silver solder 10. Then, the metal parts are plated with gold. The diode chip 6 is die-bonded to this package, and the anode of the diode chip 6 and the anode electrode pad 4 are connected to each other.
A microwave diode is constructed by bonding with gold wire 5 and attaching a cap.

[Problem to be solved by the invention]

A conventional microwave diode package is constructed as described above, and the 1% power is connected to the picture electrode of the chip diode.The pad for the node drop electrode and the pad for the anode ↑ electrode are connected to the picture electrode of the chip diode. (interface color) and resistor (8) are connected in series.Especially, the resistance and inductance increase significantly in the part sandwiched between the base dielectric and the side dielectric, and the microwave characteristics Also, there was a problem that it adversely affected the mass production yield.

This invention was made to solve the above-mentioned problems, and aims to provide a package for a microwave diode that can reduce inductance and resistance compared to conventional packages.

[Means for Solving the Problems] A microwave diode package according to the present invention has a cathode and an anode electrode pad provided on one surface of a base dielectric and an anode electrode pad provided on the opposite surface of a base iB body. The cathode lead and the anode lead are each connected through a plurality of through holes (C).

[Effect]

In this invention, the parts that were conventionally connected by thin films are connected by a plurality of through holes, so that the inductance and resistance can be reduced compared to the conventional method.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a top view of a microwave diode package according to an embodiment of the present invention with the cap removed;
FIG. 2 shows an enlarged top view with the diode chip and gold wires removed from the same top view, and FIG. 3 shows a similar side cross-sectional view, in which reference numerals 1 to 8 and 10 are the same as those of the prior art. It is something. In the figure, 9 is a lead attachment part, and 11 is a through hole.

In the package of this embodiment, the anode electrode pad 4 and the anode lead are connected through two through holes 11, and the cathode! The electrode pad 3 and the power node lead 8 are connected by three through holes 11, which reduces the inductance between each electrode lead and each diode electrode, and also reduces the resistance. Wave characteristics and yield can be improved.

〔Effect of the invention〕

As described above, according to the present invention, the cathode is provided on one surface of the base dielectric! Since the electrode pad and anode electrode pad are connected to the cathode lead and anode lead provided on the opposite side of the base dielectric through multiple through holes, the microwave characteristics and yield can be improved. be.

[Brief explanation of the drawing]

ff11 is a top view of a microwave diode package according to an embodiment of the present invention with the cap removed, FIG. 2 is an enlarged top view of the same top view with the diode chip and gold wire removed, and FIG. FIG. 1 is a side sectional view, FIG. 4 is a top view of a conventional microwave diode package with the cap removed, and FIG. 5 is a side sectional view of FIG. 4. In the figure, 1 is the base diode, 2 is the side N! body, 3 is a power node electrode pad, 4 is an anode electrode pad, 5
6 is a gold wire, 6 is a diode chip, 7 is an anode lead, 8 is a power node lead, 9 is a lead attachment part, 10 is a silver solder, and 11 is a through hole. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] In a microwave diode package consisting of a base dielectric, a side dielectric, a cathode electrode pad, an anode electrode pad, an anode lead, a cathode lead, a lead attachment part, and a cap, a A microwave diode package characterized in that a cathode electrode pad and an anode electrode pad are connected to a cathode lead and an anode lead provided on the opposite surface of a base dielectric material through a plurality of through holes.