JPH0139216B2 - - Google Patents

Info

Publication number
JPH0139216B2
JPH0139216B2 JP57111385A JP11138582A JPH0139216B2 JP H0139216 B2 JPH0139216 B2 JP H0139216B2 JP 57111385 A JP57111385 A JP 57111385A JP 11138582 A JP11138582 A JP 11138582A JP H0139216 B2 JPH0139216 B2 JP H0139216B2
Authority
JP
Japan
Prior art keywords
chip
board
reference points
coordinates
line connecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57111385A
Other languages
English (en)
Japanese (ja)
Other versions
JPS592334A (ja
Inventor
Akio Nakamura
Yasuhiro Katagiri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sokuhan Co Ltd
Original Assignee
Tokyo Sokuhan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sokuhan Co Ltd filed Critical Tokyo Sokuhan Co Ltd
Priority to JP57111385A priority Critical patent/JPS592334A/ja
Publication of JPS592334A publication Critical patent/JPS592334A/ja
Publication of JPH0139216B2 publication Critical patent/JPH0139216B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Wire Bonding (AREA)
JP57111385A 1982-06-28 1982-06-28 フエ−スダウンボンデイング方法 Granted JPS592334A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57111385A JPS592334A (ja) 1982-06-28 1982-06-28 フエ−スダウンボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57111385A JPS592334A (ja) 1982-06-28 1982-06-28 フエ−スダウンボンデイング方法

Publications (2)

Publication Number Publication Date
JPS592334A JPS592334A (ja) 1984-01-07
JPH0139216B2 true JPH0139216B2 (2) 1989-08-18

Family

ID=14559833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57111385A Granted JPS592334A (ja) 1982-06-28 1982-06-28 フエ−スダウンボンデイング方法

Country Status (1)

Country Link
JP (1) JPS592334A (2)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7148108B2 (ja) * 2017-07-06 2022-10-05 メイショウ株式会社 部品実装装置及び部品実装用プログラム
WO2019009095A1 (ja) * 2017-07-06 2019-01-10 メイショウ株式会社 部品実装装置及び部品実装用プログラム

Also Published As

Publication number Publication date
JPS592334A (ja) 1984-01-07

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