JPH0142156B2 - - Google Patents

Info

Publication number: JPH0142156B2
Authority: JP; Japan
Prior art keywords: base; circuit board; circuit; plating; conductive
Prior art date: 1984-10-12
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP60504755A

Other languages

English (en)

Japanese (ja)

Other versions

JPS62500484A (ja

Inventor

Jon Imupii

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

MINTOOPATSUKU TEKUNOROJIISU Inc

Original Assignee

MINTOOPATSUKU TEKUNOROJIISU Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1984-10-12

Filing date

1985-10-11

Publication date

1989-09-11

1985-10-11 Application filed by MINTOOPATSUKU TEKUNOROJIISU Inc filed Critical MINTOOPATSUKU TEKUNOROJIISU Inc

1987-02-26 Publication of JPS62500484A publication Critical patent/JPS62500484A/ja

1989-09-11 Publication of JPH0142156B2 publication Critical patent/JPH0142156B2/ja

Status Granted legal-status Critical Current

Links

239000010410 layer Substances 0.000 description 54
238000000034 method Methods 0.000 description 43
238000007747 plating Methods 0.000 description 43
239000003112 inhibitor Substances 0.000 description 27
239000004020 conductor Substances 0.000 description 21
238000004519 manufacturing process Methods 0.000 description 21
230000001070 adhesive effect Effects 0.000 description 18
239000000853 adhesive Substances 0.000 description 17
239000003795 chemical substances by application Substances 0.000 description 14
238000002347 injection Methods 0.000 description 13
239000007924 injection Substances 0.000 description 13
238000007772 electroless plating Methods 0.000 description 10
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
229910052802 copper Inorganic materials 0.000 description 8
239000010949 copper Substances 0.000 description 8
238000001746 injection moulding Methods 0.000 description 8
WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 8
239000000758 substrate Substances 0.000 description 8
230000000873 masking effect Effects 0.000 description 7
239000000463 material Substances 0.000 description 6
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
238000005530 etching Methods 0.000 description 5
229910052718 tin Inorganic materials 0.000 description 5
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
239000010931 gold Substances 0.000 description 4
229910052737 gold Inorganic materials 0.000 description 4
230000003213 activating effect Effects 0.000 description 3
230000004913 activation Effects 0.000 description 3
238000009713 electroplating Methods 0.000 description 3
239000002184 metal Substances 0.000 description 3
229910052751 metal Inorganic materials 0.000 description 3
239000004033 plastic Substances 0.000 description 3
229920003023 plastic Polymers 0.000 description 3
229910001174 tin-lead alloy Inorganic materials 0.000 description 3
230000015572 biosynthetic process Effects 0.000 description 2
230000003197 catalytic effect Effects 0.000 description 2
238000000151 deposition Methods 0.000 description 2
238000010586 diagram Methods 0.000 description 2
238000010438 heat treatment Methods 0.000 description 2
238000003754 machining Methods 0.000 description 2
239000002904 solvent Substances 0.000 description 2
239000004695 Polyether sulfone Substances 0.000 description 1
239000004697 Polyetherimide Substances 0.000 description 1
239000002253 acid Substances 0.000 description 1
239000000654 additive Substances 0.000 description 1
239000012790 adhesive layer Substances 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
238000000576 coating method Methods 0.000 description 1
238000005260 corrosion Methods 0.000 description 1
230000007797 corrosion Effects 0.000 description 1
230000008021 deposition Effects 0.000 description 1
238000005553 drilling Methods 0.000 description 1
238000001192 hot extrusion Methods 0.000 description 1
238000003384 imaging method Methods 0.000 description 1
238000009434 installation Methods 0.000 description 1
238000003475 lamination Methods 0.000 description 1
239000007788 liquid Substances 0.000 description 1
238000000465 moulding Methods 0.000 description 1
239000012811 non-conductive material Substances 0.000 description 1
230000003287 optical effect Effects 0.000 description 1
230000003647 oxidation Effects 0.000 description 1
238000007254 oxidation reaction Methods 0.000 description 1
208000017983 photosensitivity disease Diseases 0.000 description 1
231100000434 photosensitization Toxicity 0.000 description 1
229920006162 poly(etherimide sulfone) Polymers 0.000 description 1
229920002492 poly(sulfone) Polymers 0.000 description 1
229920006393 polyether sulfone Polymers 0.000 description 1
238000003825 pressing Methods 0.000 description 1
238000011536 re-plating Methods 0.000 description 1
238000007761 roller coating Methods 0.000 description 1
238000005096 rolling process Methods 0.000 description 1
238000007788 roughening Methods 0.000 description 1
229910000679 solder Inorganic materials 0.000 description 1
238000005476 soldering Methods 0.000 description 1
239000000126 substance Substances 0.000 description 1
229920001187 thermosetting polymer Polymers 0.000 description 1
238000005406 washing Methods 0.000 description 1

Landscapes

Production Of Multi-Layered Print Wiring Board (AREA)

JP60504755A 1984-10-12 1985-10-11 射出成形多層回路基板及びその作成方法 Granted JPS62500484A (ja)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date
US66049584A	1984-10-12	1984-10-12
US771134		1985-08-28
US660495		2000-09-12

Publications (2)

Publication Number	Publication Date
JPS62500484A JPS62500484A (ja)	1987-02-26
JPH0142156B2 true JPH0142156B2 (da)	1989-09-11

Family

ID=24649771

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP60504755A Granted JPS62500484A (ja)	1984-10-12	1985-10-11	射出成形多層回路基板及びその作成方法

Country Status (1)

Country	Link
JP (1)	JPS62500484A (da)

1985
- 1985-10-11 JP JP60504755A patent/JPS62500484A/ja active Granted

Also Published As

Publication number	Publication date
JPS62500484A (ja)	1987-02-26

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