JPH0152065B2 - - Google Patents
Info
- Publication number
- JPH0152065B2 JPH0152065B2 JP58118597A JP11859783A JPH0152065B2 JP H0152065 B2 JPH0152065 B2 JP H0152065B2 JP 58118597 A JP58118597 A JP 58118597A JP 11859783 A JP11859783 A JP 11859783A JP H0152065 B2 JPH0152065 B2 JP H0152065B2
- Authority
- JP
- Japan
- Prior art keywords
- coating liquid
- pressure
- supply pipe
- coating
- sealed container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
【発明の詳細な説明】
本発明はガスの圧力を利用して、被処理体上に
塗布液を滴下供給する方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of dripping and supplying a coating liquid onto an object to be processed using gas pressure.
一般にシリコンウエハー、ガラスなどの被処理
体表面に、ホトレジスト膜、不純物拡散剤膜、光
学用被膜或いは保護被膜を形成するには、塗布液
を入れた密閉容器内にチツ素ガスを導入して容器
内を高圧とし、この圧力で容器内の塗布液を供給
管を介して圧送し、被処理体上に滴下する方法が
採られている。 Generally, to form a photoresist film, an impurity diffusing agent film, an optical film, or a protective film on the surface of a workpiece such as a silicon wafer or glass, nitrogen gas is introduced into a sealed container containing a coating solution. A method is adopted in which the interior of the container is kept under high pressure, and the coating liquid in the container is pumped through a supply pipe using this pressure and dripped onto the object to be treated.
そして、上記塗布液がトルエン、キシレンなど
の比較的極性の弱い溶媒を用いて調製されている
場合には問題は生じないが、ポジ型ホトレジスト
系膜、不純物拡散剤膜、保護膜或いは光学用被膜
を形成する場合には、一般にアルコール系、ケト
ン系、ハロゲン化炭化水素系、エステル系、エー
テル系、含チツ素系、含イオン系或いは含リン系
などの極性の強い溶媒を用いており、この場合に
は以下の如き不具合がある。 If the above coating solution is prepared using a relatively weakly polar solvent such as toluene or xylene, no problem will occur, but if the coating solution is a positive photoresist film, an impurity diffusion agent film, a protective film, or an optical coating. In order to form In this case, the following problems occur.
即ち、密閉容器内をチツ素ガスによつて高圧に
すると、一定温度で一定量の液体に溶解する気体
の質量はその気体の圧力に比例するというヘンリ
ーの法則から、高圧にすればそれだけ塗布液に溶
解するチツ素ガスの量が多くなり、特にチツ素ガ
スのオストワルド吸収係数(溶解度)は高く、そ
のため多量に溶解することとなる。そして、塗布
液は供給管を介して常圧状態で被処理体の表面に
滴下されるため、滴下時には塗布液中に過飽和の
状態で溶解していたチツ素ガスが微細な気泡とな
つて発生し、この気泡を有したまま塗布されるこ
とで、気泡が被膜中に固定される。 In other words, if the pressure inside a closed container is made high with nitrogen gas, Henry's law states that the mass of gas dissolved in a certain amount of liquid at a certain temperature is proportional to the pressure of that gas. In particular, the Ostwald absorption coefficient (solubility) of nitrogen gas is high, so a large amount of nitrogen gas is dissolved. Since the coating liquid is dripped onto the surface of the workpiece through the supply pipe under normal pressure, the nitrogen gas dissolved in the coating liquid in a supersaturated state forms fine bubbles when it is dripped. However, by applying the coating with the air bubbles present, the air bubbles are fixed in the film.
その結果、ピンホール或いは塗布ムラが生じ、
これが製品歩留りの低下につながつている。 As a result, pinholes or uneven coating occur,
This leads to a decrease in product yield.
これを解決すべく、塗布液の供給管の途中にト
ラツプを設け、圧送途中にて気泡を除去すること
が考えられるが、装置自体複雑となり、しかも気
泡の除去を完全に行なえないという不利がある。 In order to solve this problem, it may be possible to install a trap in the middle of the coating liquid supply pipe and remove air bubbles during pressure feeding, but this has the disadvantage that the device itself is complicated and it is not possible to completely remove air bubbles. .
本発明は上述した問題に鑑みなしたものであ
り、その目的とする処は塗布装置に何ら特別な部
材等を付設することなく、塗布液中への溶存ガス
の量を可及的に少なくし、もつて塗布時に気泡の
発生を防止し、ピンホール或いは塗布ムラのない
製品が得られる塗布液の供給方法を提供するにあ
る。 The present invention was developed in view of the above-mentioned problems, and its purpose is to reduce the amount of dissolved gas in the coating liquid as much as possible without adding any special parts to the coating device. It is an object of the present invention to provide a method for supplying a coating liquid that prevents the generation of bubbles during coating and allows a product without pinholes or uneven coating to be obtained.
斯る目的を達成すべく本発明は、密閉容器内に
極性の強い溶媒を用いた塗布液を入れ、この密閉
容器内に高圧ガス導入管を介して溶解度の小さい
ヘリウムガス又はネオンガスを供給し、このガス
圧によつて塗布液を供給管を介して圧送するよう
にしたことを要旨とする。 In order to achieve such an object, the present invention includes placing a coating solution using a highly polar solvent in a closed container, supplying helium gas or neon gas with low solubility into the closed container via a high-pressure gas introduction pipe, The gist is that the coating liquid is force-fed through the supply pipe using this gas pressure.
以下に本発明の実施例を添付図面に基づいて説
明する。 Embodiments of the present invention will be described below based on the accompanying drawings.
図中1は密閉容器、2はスピンナーであり、密
閉容器1内には極性の強い溶媒により調整された
塗布液3が充填され、スピンナー2の有底筒状体
4には下方から回転軸5が挿通され、この回転軸
5の先端部にはスピンナーヘツド6を取付け、こ
のスピンナーヘツド6上にシリコンウエハーなど
の被処理体7が載置される。 In the figure, 1 is an airtight container, and 2 is a spinner. The airtight container 1 is filled with a coating liquid 3 adjusted with a highly polar solvent, and the bottomed cylindrical body 4 of the spinner 2 is filled with a rotating shaft 5 from below. A spinner head 6 is attached to the tip of the rotating shaft 5, and an object 7 to be processed, such as a silicon wafer, is placed on the spinner head 6.
一方、密閉容器1内には高圧ガス導入管8及び
塗布液の供給管9が挿通され、高圧ガス導入管8
の下端部は塗布液3の液面よりも上方に位置せし
められ、供給管9の下端部は液面よりも下方で密
閉容器1の底面近傍に位置せしめられている。ま
た供給管9の他端部には塗布液滴下用のノズル1
0が取付けられ、このノズル10がスピンナーヘ
ツド6上方に臨んでいる。更に、供給管9の中間
部には高圧空気等によつて駆動する弁11及び塗
布を停止した後に塗布液がボタ落ちするのを防止
するサツクバツク機構12が設けられている。 On the other hand, a high pressure gas introduction pipe 8 and a coating liquid supply pipe 9 are inserted into the closed container 1.
The lower end of the supply pipe 9 is located above the liquid level of the coating liquid 3, and the lower end of the supply pipe 9 is located below the liquid level and near the bottom of the closed container 1. Further, at the other end of the supply pipe 9, there is a nozzle 1 for dropping the coating liquid.
0 is attached, and this nozzle 10 faces above the spinner head 6. Furthermore, a valve 11 driven by high-pressure air or the like and a suction mechanism 12 for preventing the coating liquid from dripping after coating is stopped are provided in the middle of the supply pipe 9.
以上において、密閉容器1内に塗布液3を充填
して静置することで脱泡し、これと同時にスピン
ナーヘツド6上に被処理体7を載置し真空吸着す
る。斯る状態から高圧ガス導入管8を介して密閉
容器1内にヘリウムガス又はネオンガスを導入
し、密閉容器1内を高圧にする。次いで、弁11
を作動させて供給管9全体、つまり密閉容器1か
らノズル10に至る供給管9内に塗布液3を充填
した後、一旦弁11を閉じる。この後弁11を開
き、ノズル10から被処理体7表面に塗布液3を
滴下するとともに、スピンナー2の回転軸5を回
転せしめる。すると滴下された塗布液3は遠心力
によつて被処理体7表面に均一な厚さに塗布され
る。 In the above process, the coating liquid 3 is filled into the closed container 1 and left to stand for defoaming, and at the same time, the object to be processed 7 is placed on the spinner head 6 and vacuum-adsorbed. From this state, helium gas or neon gas is introduced into the closed container 1 through the high-pressure gas introduction pipe 8 to make the inside of the closed container 1 high pressure. Then, valve 11
is operated to fill the entire supply pipe 9, that is, the supply pipe 9 from the closed container 1 to the nozzle 10, with the coating liquid 3, and then the valve 11 is temporarily closed. After that, the valve 11 is opened, and the coating liquid 3 is dripped from the nozzle 10 onto the surface of the object to be processed 7, and the rotating shaft 5 of the spinner 2 is rotated. Then, the dropped coating liquid 3 is applied to the surface of the object to be processed 7 to a uniform thickness by centrifugal force.
ここで、密閉容器1内に導入される加圧用ガス
は、溶解度の小さなヘリウムガス或はネオンガス
であるため、密閉容器1内の圧を高めても極めて
僅かしか塗布液3に溶解せず、したがつて滴下時
に常圧状態に戻されても塗布液3中の気泡の発生
を抑制でき、塗布液3は被処理体7表面に均一に
塗布される。 Here, since the pressurizing gas introduced into the sealed container 1 is helium gas or neon gas with low solubility, even if the pressure inside the sealed container 1 is increased, only a very small amount dissolves in the coating liquid 3, and Even if the pressure is then returned to normal pressure during dropping, the generation of bubbles in the coating liquid 3 can be suppressed, and the coating liquid 3 can be uniformly applied to the surface of the object 7 to be treated.
以上に説明した如く本発明によれば、極性の強
い溶媒を用いて塗布液を調整し、この塗布液を加
圧することで圧送し、常圧下において被処理体表
面に滴下するようにしても、被処理体表面の塗布
液には気泡の発生はなく、したがつて後にピンホ
ールや塗布ムラなどの不利が生じることがない。
したがつて製品の歩留りを大巾に向上でき、更に
以上を特別な装置例えばトラツプ等を設けること
なく達成できる等多くの効果を発揮する。 As explained above, according to the present invention, even if a coating liquid is prepared using a highly polar solvent, the coating liquid is fed under pressure, and is dripped onto the surface of the object to be treated under normal pressure, There are no bubbles in the coating liquid on the surface of the object to be treated, and therefore disadvantages such as pinholes and uneven coating do not occur later.
Therefore, the yield of products can be greatly improved, and furthermore, the above can be achieved without providing any special equipment such as a trap, etc., and many other effects are exhibited.
図面は本発明方法を実施するための塗布装置の
概略側面図である。
尚、図面中1は密閉容器、2はスピンナー、3
は塗布液、7は被処理体、8は高圧ガス導入管、
9は塗布液の供給管、10はノズルである。
The drawing is a schematic side view of a coating device for carrying out the method of the invention. In addition, in the drawing, 1 is a closed container, 2 is a spinner, and 3 is a closed container.
is a coating liquid, 7 is an object to be treated, 8 is a high-pressure gas introduction pipe,
9 is a supply pipe for the coating liquid, and 10 is a nozzle.
Claims (1)
に充填するとともに、該密閉容器内に高圧ガス導
入管及び塗布液供給管を臨ませ、該高圧ガス導入
管の下端部を塗布液の液面よりも上方に、該塗布
液供給管の下端部を塗布液の液面よりも下方に位
置せしめ、次いで高圧ガス導入管を介して密閉容
器内にヘリウムガス又はネオンガスを導入して密
閉容器内を高圧とし、密閉容器内の圧により塗布
液を供給管を介して被処理体表面に滴下するよう
にしたことを特徴とする塗布液の供給方法。1 Fill a sealed container with a coating liquid using a highly polar solvent, place a high-pressure gas introduction pipe and a coating liquid supply pipe facing into the sealed container, and connect the lower end of the high-pressure gas introduction pipe to the coating liquid. The lower end of the coating liquid supply pipe is positioned above the liquid level of the coating liquid, and then helium gas or neon gas is introduced into the sealed container via the high-pressure gas introduction pipe to cause the inside of the sealed container to rise. A method for supplying a coating liquid, characterized in that the pressure inside the sealed container is set at high pressure, and the coating liquid is dripped onto the surface of the object to be treated through a supply pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58118597A JPS6012175A (en) | 1983-06-30 | 1983-06-30 | Coating liquid supplying method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58118597A JPS6012175A (en) | 1983-06-30 | 1983-06-30 | Coating liquid supplying method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6012175A JPS6012175A (en) | 1985-01-22 |
| JPH0152065B2 true JPH0152065B2 (en) | 1989-11-07 |
Family
ID=14740511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58118597A Granted JPS6012175A (en) | 1983-06-30 | 1983-06-30 | Coating liquid supplying method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6012175A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0727150U (en) * | 1993-10-07 | 1995-05-19 | 大日本スクリーン製造株式会社 | Silica-based coating liquid ejector |
| KR100807667B1 (en) * | 2002-07-25 | 2008-03-03 | 주식회사 포스코 | Insulation Coating Solution |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4958775A (en) * | 1972-10-04 | 1974-06-07 | ||
| JPS55108741A (en) * | 1979-02-15 | 1980-08-21 | Pioneer Electronic Corp | Resist coating device |
| JPS56106451U (en) * | 1980-01-16 | 1981-08-19 |
-
1983
- 1983-06-30 JP JP58118597A patent/JPS6012175A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6012175A (en) | 1985-01-22 |
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