JPH0163132U - - Google Patents

Info

Publication number
JPH0163132U
JPH0163132U JP1987157486U JP15748687U JPH0163132U JP H0163132 U JPH0163132 U JP H0163132U JP 1987157486 U JP1987157486 U JP 1987157486U JP 15748687 U JP15748687 U JP 15748687U JP H0163132 U JPH0163132 U JP H0163132U
Authority
JP
Japan
Prior art keywords
stage
ring
sealing device
gas
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987157486U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987157486U priority Critical patent/JPH0163132U/ja
Publication of JPH0163132U publication Critical patent/JPH0163132U/ja
Pending legal-status Critical Current

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  • Drying Of Semiconductors (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例を示す真空シール装置
の要部断面図、第2図はその真空シール装置のシ
ール状態を示す要部断面図、第3図は従来の真空
シール装置の断面図である。 1…エツチングチヤンバ、2…シリンダ、3…
ウエハ、4…ステージ、7…ベローズ、9…ガス
、11…Oリング。
Fig. 1 is a sectional view of essential parts of a vacuum sealing device showing an embodiment of the present invention, Fig. 2 is a sectional view of essential parts showing the sealing state of the vacuum sealing device, and Fig. 3 is a sectional view of a conventional vacuum sealing device. It is. 1...Etching chamber, 2...Cylinder, 3...
Wafer, 4... Stage, 7... Bellows, 9... Gas, 11... O-ring.

Claims (1)

【実用新案登録請求の範囲】 ガスを用い、減圧雰囲気で半導体ウエハの処理
を行う反応槽中に大気側から半導体ウエハが載置
するステージの往復動作を行う部分をシールする
真空シール装置において、 前記ステージと反応槽との間にOリングを配置
し、ガスにより半導体ウエハの処理を行う時には
前記ステージを前記Oリングへ押付けて、該Oリ
ングによりシールすることを特徴とする真空シー
ル装置。
[Claims for Utility Model Registration] In a vacuum sealing device for sealing a reciprocating portion of a stage on which a semiconductor wafer is placed from the atmosphere side in a reaction tank in which semiconductor wafers are processed in a reduced pressure atmosphere using gas, A vacuum sealing device characterized in that an O-ring is disposed between a stage and a reaction tank, and when semiconductor wafers are processed with gas, the stage is pressed against the O-ring and sealed by the O-ring.
JP1987157486U 1987-10-16 1987-10-16 Pending JPH0163132U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987157486U JPH0163132U (en) 1987-10-16 1987-10-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987157486U JPH0163132U (en) 1987-10-16 1987-10-16

Publications (1)

Publication Number Publication Date
JPH0163132U true JPH0163132U (en) 1989-04-24

Family

ID=31436972

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987157486U Pending JPH0163132U (en) 1987-10-16 1987-10-16

Country Status (1)

Country Link
JP (1) JPH0163132U (en)

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