JPH0260232U - - Google Patents
Info
- Publication number
- JPH0260232U JPH0260232U JP13970588U JP13970588U JPH0260232U JP H0260232 U JPH0260232 U JP H0260232U JP 13970588 U JP13970588 U JP 13970588U JP 13970588 U JP13970588 U JP 13970588U JP H0260232 U JPH0260232 U JP H0260232U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- dry etching
- reaction chamber
- adsorbing
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Drying Of Semiconductors (AREA)
Description
第１図は本考案の一実施例を示す構成図、第２
図は第１図のカソードを示す平面図、第３図は第
２図の縦断面図、第４図は従来のドライエツチン
グ装置を示す構成図である。
１……ウエハー、２……反応室、３……カソー
ド、４……アノード、５……冷却水供給装置、６
……インピーダンス整合器、７……高周波電源、
８……ガス供給装置、９……圧力ゲージ、１０…
…真空ポンプ、１１……高真空ポンプ、１２……
バルブ、１３……バルブ、１４……不活性ガス源
、１５……Ｏリング、１６……真空孔、１７……
真空ゲージ。
Fig. 1 is a configuration diagram showing one embodiment of the present invention;
3 is a plan view showing the cathode of FIG. 1, FIG. 3 is a longitudinal sectional view of FIG. 2, and FIG. 4 is a configuration diagram showing a conventional dry etching apparatus. DESCRIPTION OF SYMBOLS 1... Wafer, 2... Reaction chamber, 3... Cathode, 4... Anode, 5... Cooling water supply device, 6
... Impedance matching box, 7... High frequency power supply,
8... Gas supply device, 9... Pressure gauge, 10...
...Vacuum pump, 11...High vacuum pump, 12...
Valve, 13...Valve, 14...Inert gas source, 15...O ring, 16...Vacuum hole, 17...
vacuum gauge.
Claims (1)
成膜された薄膜をドライエツチングする装置にお
いて、ウエハーを載置する電極に、反応室雰囲気
圧力より低い圧力でウエハーを裏面より吸着する
機構を有することを特徴とするドライエツチング
装置。 An apparatus for dry etching a thin film formed on the surface of a semiconductor wafer using plasma gas, characterized in that the electrode on which the wafer is placed has a mechanism for adsorbing the wafer from the back side at a pressure lower than the atmospheric pressure in the reaction chamber. Dry etching equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13970588U JPH0260232U (en) | 1988-10-26 | 1988-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13970588U JPH0260232U (en) | 1988-10-26 | 1988-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0260232U true JPH0260232U (en) | 1990-05-02 |
Family
ID=31403213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13970588U Pending JPH0260232U (en) | 1988-10-26 | 1988-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0260232U (en) |
-
1988
- 1988-10-26 JP JP13970588U patent/JPH0260232U/ja active Pending
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