JPH0170346U - - Google Patents

Info

Publication number
JPH0170346U
JPH0170346U JP1987165533U JP16553387U JPH0170346U JP H0170346 U JPH0170346 U JP H0170346U JP 1987165533 U JP1987165533 U JP 1987165533U JP 16553387 U JP16553387 U JP 16553387U JP H0170346 U JPH0170346 U JP H0170346U
Authority
JP
Japan
Prior art keywords
package
integrated circuit
connection terminals
back surface
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987165533U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987165533U priority Critical patent/JPH0170346U/ja
Publication of JPH0170346U publication Critical patent/JPH0170346U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案のＰＧＡの断面図、第２図は上
面図である（実施例１）。第３図は本考案のＰＧ
Ａの断面図、第４図は裏面図である（実施例２）
。各部の名称は実施例１と重複するため省略する
。 １……基板、２……端子、３……キヤツプ、４
……電極、５……配線パターン、６……チツプ、
７……接着材、８……スルーホール、９……ボン
デイングワイヤ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 接続端子が格子状に配置された集積回路容器（
    ピングリツトアレイパツケージ）において、パツ
    ケージ表面、又は裏面に接続端子と電気的に接続
    された回路部品接続用電極を有することを特徴と
    する集積回路容器。
JP1987165533U 1987-10-28 1987-10-28 Pending JPH0170346U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987165533U JPH0170346U (ja) 1987-10-28 1987-10-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987165533U JPH0170346U (ja) 1987-10-28 1987-10-28

Publications (1)

Publication Number Publication Date
JPH0170346U true JPH0170346U (ja) 1989-05-10

Family

ID=31452104

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987165533U Pending JPH0170346U (ja) 1987-10-28 1987-10-28

Country Status (1)

Country Link
JP (1) JPH0170346U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6230346B2 (ja) * 1979-10-19 1987-07-01 Aisin Seiki

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6230346B2 (ja) * 1979-10-19 1987-07-01 Aisin Seiki

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