JPH0178045U - - Google Patents
Info
- Publication number
- JPH0178045U JPH0178045U JP1987173376U JP17337687U JPH0178045U JP H0178045 U JPH0178045 U JP H0178045U JP 1987173376 U JP1987173376 U JP 1987173376U JP 17337687 U JP17337687 U JP 17337687U JP H0178045 U JPH0178045 U JP H0178045U
- Authority
- JP
- Japan
- Prior art keywords
- pin
- package
- back surface
- grid array
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002265 prevention Effects 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の側面図、第２図ａ
，ｂ及び第３図はそれぞれ本考案のＰＧＡの製造
方法の第１及び第２の実施例を説明するための側
面図、第４図は従来のＰＧＡの一例の側面図、第
５図は従来のＰＧＡの製造方法の一例を説明する
ための側面図である。
１……パツケージ基板、２，２′……ピン、２
ａ……頭部、３，３′……つば、４，４′……ス
トツパリング、５ａ，５ａ′，５ｂ，５ｂ′……
金型、６……ポンチ。
Figure 1 is a side view of an embodiment of the present invention, Figure 2a
, b and 3 are side views for explaining the first and second embodiments of the PGA manufacturing method of the present invention, respectively, FIG. 4 is a side view of an example of a conventional PGA, and FIG. 5 is a side view of a conventional PGA. FIG. 2 is a side view for explaining an example of a method for manufacturing a PGA. 1...Package board, 2, 2'...Pin, 2
a... Head, 3, 3'... Brim, 4, 4'... Stopper ring, 5a, 5a', 5b, 5b'...
Mold, 6... punch.
Claims (1)
前記パツケージ基板の裏面の接触防止用のストツ
パリングを備えた接触防止用ピンを含むピングリ
ツドアレーパツケージにおいて、前記接触防止用
ピンの側面に設けた落下防止用突起部と前記パツ
ケージ基板との間に前記ストツパリングを配置し
たことを特徴とするピングリツドアレーパツケー
ジ。 In a pin grid array package including a contact prevention pin having a large number of pins arranged on the back surface of the package board and a stopper ring for preventing contact on the back surface of the package board, a fall prevention device provided on the side surface of the contact prevention pin A pin grid array package, characterized in that the stop ring is disposed between the pin protrusion and the package substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987173376U JPH0178045U (en) | 1987-11-13 | 1987-11-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987173376U JPH0178045U (en) | 1987-11-13 | 1987-11-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0178045U true JPH0178045U (en) | 1989-05-25 |
Family
ID=31465300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987173376U Pending JPH0178045U (en) | 1987-11-13 | 1987-11-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0178045U (en) |
-
1987
- 1987-11-13 JP JP1987173376U patent/JPH0178045U/ja active Pending
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