JPH0179833U - - Google Patents

Info

Publication number
JPH0179833U
JPH0179833U JP1987175671U JP17567187U JPH0179833U JP H0179833 U JPH0179833 U JP H0179833U JP 1987175671 U JP1987175671 U JP 1987175671U JP 17567187 U JP17567187 U JP 17567187U JP H0179833 U JPH0179833 U JP H0179833U
Authority
JP
Japan
Prior art keywords
metallized
patterns
semiconductor device
thicker
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987175671U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987175671U priority Critical patent/JPH0179833U/ja
Publication of JPH0179833U publication Critical patent/JPH0179833U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例による半導体装置
を示す断面図、第２図は従来の半導体装置を示す
断面図である。 １はアルミナ、ベリリア等の磁器、２はモリブ
デン−マンガン等のメタライズパターン層、２ａ
はパターンを構成するアイランド部、２ｂは部分
的にメタライズ厚を増した凸部、３は金、銀等の
表面メツキ層、４は接続用細線である。なお、図
中、同一符号は同一、または相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. セラミツク上の微細メタライズパターン間を細
    線でつなぐ際、途中のパターンに接触することを
    避けるため、メタライズ層の一部を高く（メタラ
    イズ厚を厚く）したことを特徴とする半導体装置
    。
JP1987175671U 1987-11-17 1987-11-17 Pending JPH0179833U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987175671U JPH0179833U (ja) 1987-11-17 1987-11-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987175671U JPH0179833U (ja) 1987-11-17 1987-11-17

Publications (1)

Publication Number Publication Date
JPH0179833U true JPH0179833U (ja) 1989-05-29

Family

ID=31467456

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987175671U Pending JPH0179833U (ja) 1987-11-17 1987-11-17

Country Status (1)

Country Link
JP (1) JPH0179833U (ja)

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