JPS6232554U - - Google Patents

Info

Publication number
JPS6232554U
JPS6232554U JP1985124896U JP12489685U JPS6232554U JP S6232554 U JPS6232554 U JP S6232554U JP 1985124896 U JP1985124896 U JP 1985124896U JP 12489685 U JP12489685 U JP 12489685U JP S6232554 U JPS6232554 U JP S6232554U
Authority
JP
Japan
Prior art keywords
nickel
plating
layer
nickel layer
sintering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985124896U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985124896U priority Critical patent/JPS6232554U/ja
Publication of JPS6232554U publication Critical patent/JPS6232554U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の製造中間段階にお
ける断面図、第２図は従来の銀ボタンダイオード
の製造中間段階における断面図である。 １：シリコン板、５：Ａｕめつき層、６：Ａｇ
電極、６２：Ａｇめつき層、８：Ｎｉ層。

Claims (1)

    【実用新案登録請求の範囲】
  1. 銀電極が、半導体基板上にニツケルめつき後シ
    ンタ処理し、さらにその上にめつきして形成され
    たニツケル層およびその上の金層を介して形成さ
    れたことを特徴とする半導体装置。
JP1985124896U 1985-08-14 1985-08-14 Pending JPS6232554U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985124896U JPS6232554U (ja) 1985-08-14 1985-08-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985124896U JPS6232554U (ja) 1985-08-14 1985-08-14

Publications (1)

Publication Number Publication Date
JPS6232554U true JPS6232554U (ja) 1987-02-26

Family

ID=31017315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985124896U Pending JPS6232554U (ja) 1985-08-14 1985-08-14

Country Status (1)

Country Link
JP (1) JPS6232554U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56142633A (en) * 1980-04-08 1981-11-07 Mitsubishi Electric Corp Forming method for back electrode of semiconductor wafer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56142633A (en) * 1980-04-08 1981-11-07 Mitsubishi Electric Corp Forming method for back electrode of semiconductor wafer

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