JPH02113338U - - Google Patents

Info

Publication number
JPH02113338U
JPH02113338U JP2262289U JP2262289U JPH02113338U JP H02113338 U JPH02113338 U JP H02113338U JP 2262289 U JP2262289 U JP 2262289U JP 2262289 U JP2262289 U JP 2262289U JP H02113338 U JPH02113338 U JP H02113338U
Authority
JP
Japan
Prior art keywords
ceramic substrate
semiconductor chip
metal wire
thin metal
conductor pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2262289U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2262289U priority Critical patent/JPH02113338U/ja
Publication of JPH02113338U publication Critical patent/JPH02113338U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は、本考案の一実施例による半導体装置
の縦断面図である。第２図は、従来の半導体装置
の縦断面図である。 １……樹脂、２……セラミツク基板、３……半
導体チツプ、４……金属細線、５……外部リード
、６……導体パターン、７……空洞。

Claims (1)

    【実用新案登録請求の範囲】
  1. 複数の導体パターンを有し、表面に開孔する空
    洞を有するセラミツク基板と、該セラミツク基板
    上の前記導体パターン上に搭載された半導体チツ
    プと、該半導体チツプの電極と前記セラミツク基
    板上の他の導体パターンとを接続する金属細線と
    、前記半導体チツプと前記金属細線とを覆つて前
    記セラミツク基板上を封止する樹脂とを有するこ
    とを特徴とする半導体装置。
JP2262289U 1989-02-27 1989-02-27 Pending JPH02113338U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2262289U JPH02113338U (ja) 1989-02-27 1989-02-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2262289U JPH02113338U (ja) 1989-02-27 1989-02-27

Publications (1)

Publication Number Publication Date
JPH02113338U true JPH02113338U (ja) 1990-09-11

Family

ID=31240899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2262289U Pending JPH02113338U (ja) 1989-02-27 1989-02-27

Country Status (1)

Country Link
JP (1) JPH02113338U (ja)

Similar Documents

Publication Publication Date Title
JPH02113338U (ja)
JPH0350338U (ja)
JPH0336137U (ja)
JPH0279047U (ja)
JPS63170983U (ja)
JPH0336478U (ja)
JPH0279046U (ja)
JPS62192648U (ja)
JPS6364035U (ja)
JPH0356146U (ja)
JPH0273740U (ja)
JPS61192447U (ja)
JPH0343732U (ja)
JPH0262734U (ja)
JPH0252443U (ja)
JPS6418738U (ja)
JPS6161833U (ja)
JPH0173935U (ja)
JPS6094836U (ja) 半導体装置
JPH0188505U (ja)
JPH0288240U (ja)
JPS62199948U (ja)
JPS61195054U (ja)
JPS62145337U (ja)
JPS6375044U (ja)