JPH0179842U - - Google Patents

Info

Publication number
JPH0179842U
JPH0179842U JP1987175665U JP17566587U JPH0179842U JP H0179842 U JPH0179842 U JP H0179842U JP 1987175665 U JP1987175665 U JP 1987175665U JP 17566587 U JP17566587 U JP 17566587U JP H0179842 U JPH0179842 U JP H0179842U
Authority
JP
Japan
Prior art keywords
distance
leads
exposed metal
metal part
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987175665U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987175665U priority Critical patent/JPH0179842U/ja
Publication of JPH0179842U publication Critical patent/JPH0179842U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図ａ，ｂ，ｃはこの考案の実施例を示す説
明図、第２図ａ，ｂ，ｃは従来の電力用半導体装
置の説明図である。図において、１は金属フレー
ム、２はシリコンチツプ、３はワイヤ、４はモー
ルド、５はタイバーカツト部、６はへこみ、７，
８は凹みである。なお、図中、同一符号は同一又
は相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. フレームのタイバカツト残りの金属露出部と取
    り付け放熱フインの距離が２．５mm以上、沿面距
    離が３mm以上になるようにフレームを曲げ、かつ
    、この金属露出部の下のモールドにへこみを設け
    、さらに、リード間の空間距離を１．５mm以上、
    沿面距離が２mm以上になるよう相互のリードの対
    向部のストツパを取り除き、かつ、センターリー
    ドの根元のモールド部分を他のリードの根元のモ
    ールド部分より凹みを形成してなるフルパツク外
    装を施こした電力用半導体装置。
JP1987175665U 1987-11-17 1987-11-17 Pending JPH0179842U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987175665U JPH0179842U (ja) 1987-11-17 1987-11-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987175665U JPH0179842U (ja) 1987-11-17 1987-11-17

Publications (1)

Publication Number Publication Date
JPH0179842U true JPH0179842U (ja) 1989-05-29

Family

ID=31467450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987175665U Pending JPH0179842U (ja) 1987-11-17 1987-11-17

Country Status (1)

Country Link
JP (1) JPH0179842U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009135444A (ja) * 2007-10-15 2009-06-18 Power Integrations Inc パワー半導体デバイスのためのパッケージ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009135444A (ja) * 2007-10-15 2009-06-18 Power Integrations Inc パワー半導体デバイスのためのパッケージ

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