JPH0180927U - - Google Patents
Info
- Publication number
- JPH0180927U JPH0180927U JP1987176633U JP17663387U JPH0180927U JP H0180927 U JPH0180927 U JP H0180927U JP 1987176633 U JP1987176633 U JP 1987176633U JP 17663387 U JP17663387 U JP 17663387U JP H0180927 U JPH0180927 U JP H0180927U
- Authority
- JP
- Japan
- Prior art keywords
- heat treatment
- retention means
- peripheral surface
- reaction tube
- vertical semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000014759 maintenance of location Effects 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims 1
- 239000002244 precipitate Substances 0.000 claims 1
- 230000000717 retained effect Effects 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Description
第１図は、この考案に係る縦型半導体熱処理装
置の縦断面図、第２図、第３図は、縦型半導体熱
処理装置のヒートキヤツプの斜視図および縦断面
図、第４図は、別実施例における縦型半導体熱処
理装置のヒートキヤツプの縦断面図である。
１０：縦型半導体熱処理装置、１１：ヒートキ
ヤツプ、１２：滞留手段、１４：ヒートキヤツプ
の外周面、１６：滞留溝付フランジ（滞留手段）
、１８：滞留溝、１９：環形溝（滞留手段）、２
０：反応管、３２：ウエーハボート、３４：ボー
トローダ、３６：支持ロツド、４０：排気リング
、４２：排気孔。
FIG. 1 is a longitudinal sectional view of a vertical semiconductor heat treatment apparatus according to the invention, FIGS. 2 and 3 are a perspective view and a longitudinal sectional view of a heat cap of the vertical semiconductor heat treatment apparatus, and FIG. FIG. 2 is a longitudinal sectional view of a heat cap of a vertical semiconductor heat treatment apparatus in an example. 10: Vertical semiconductor heat treatment equipment, 11: Heat cap, 12: Retention means, 14: Outer peripheral surface of heat cap, 16: Retention grooved flange (retention means)
, 18: Retention groove, 19: Annular groove (retention means), 2
0: reaction tube, 32: wafer boat, 34: boat loader, 36: support rod, 40: exhaust ring, 42: exhaust hole.
Claims (1)
化、析出して付着する液体や固体を滞留させて、
落下を防止する滞留手段を有する縦型半導体熱処
理装置。 (2) 滞留手段が、ウエーハボートとともに反応
管内に搬入されて反応管の開口を閉塞するヒート
キヤツプの外周面に設けられたことを特徴とする
実用新案登録請求の範囲第１項記載の縦型半導体
熱処理装置。 (3) 滞留手段が、ヒートキヤツプ外周面の下端
部に形成された滞溜溝付外方フランジである実用
新案登録請求の範囲第２項記載の縦型半導体熱処
理装置。 (4) 滞留手段が、ヒートキヤツプ外周面の下端
部に形成された環形溝である実用新案登録請求の
範囲第２項記載の縦型半導体熱処理装置。 (5) 滞留手段が、反応管の内周面の上端部に設
けられたことを特徴とする実用新案登録請求の範
囲第１項記載の縦型半導体熱処理装置。[Scope of claim for utility model registration] (1) When heat-treating a semiconductor substrate, liquids and solids that liquefy, precipitate, and adhere in a reaction tube are retained,
Vertical semiconductor heat treatment equipment with retention means to prevent falling. (2) The vertical type according to claim 1, wherein the retention means is provided on the outer peripheral surface of a heat cap that is carried into the reaction tube together with the wafer boat and closes the opening of the reaction tube. Semiconductor heat treatment equipment. (3) The vertical semiconductor heat treatment apparatus according to claim 2, wherein the retention means is an outer flange with a retention groove formed at the lower end of the outer peripheral surface of the heat cap. (4) The vertical semiconductor heat treatment apparatus according to claim 2, wherein the retention means is an annular groove formed at the lower end of the outer peripheral surface of the heat cap. (5) The vertical semiconductor heat treatment apparatus according to claim 1, wherein the retention means is provided at the upper end of the inner peripheral surface of the reaction tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176633U JPH0180927U (en) | 1987-11-19 | 1987-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176633U JPH0180927U (en) | 1987-11-19 | 1987-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0180927U true JPH0180927U (en) | 1989-05-30 |
Family
ID=31468356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987176633U Pending JPH0180927U (en) | 1987-11-19 | 1987-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0180927U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS614426B2 (en) * | 1977-08-26 | 1986-02-10 | Nippon Zeon Co |
-
1987
- 1987-11-19 JP JP1987176633U patent/JPH0180927U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS614426B2 (en) * | 1977-08-26 | 1986-02-10 | Nippon Zeon Co |