JPH0180935U - - Google Patents

Description

[Brief explanation of the drawing]

Fig. 1a is a front view showing Embodiment 1 of the present invention, Fig. 1b is a plan view thereof, Fig. 1c is a side view thereof, and Fig. 2 is a side view showing Embodiment 2 of the invention. 3a is a front view showing a conventional example, and FIG. 3b is a plan view thereof. 1...Film, 2...Semiconductor integrated circuit element,
4...Drum section, 5...Pick up tool, 6
...transport department.

Claims (1)

[Scope of utility model registration request] The semiconductor substrate is individually cut and separated into a plurality of semiconductor integrated circuit elements while still attached to the film, and the individually cut and separated semiconductor integrated circuit elements are taken out from the film using a pick-up tool and made into thin metal plates that will become external connection terminals. In the bonding device, a drum portion for winding the film attached with a plurality of semiconductor integrated circuit elements individually cut and separated from a semiconductor substrate along an arcuate peripheral surface, and feeding the film wound around the drum portion; A semiconductor integrated circuit manufacturing apparatus comprising a transfer section that transfers semiconductor integrated circuit elements to a suction area of the pick-up tool for each row along the axial direction of the drum section.