JPH0183063U - - Google Patents
Info
- Publication number
- JPH0183063U JPH0183063U JP1987175515U JP17551587U JPH0183063U JP H0183063 U JPH0183063 U JP H0183063U JP 1987175515 U JP1987175515 U JP 1987175515U JP 17551587 U JP17551587 U JP 17551587U JP H0183063 U JPH0183063 U JP H0183063U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- vacuum chamber
- evaporation material
- evaporation
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001704 evaporation Methods 0.000 claims description 12
- 230000008020 evaporation Effects 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 8
- 238000007733 ion plating Methods 0.000 claims description 5
- 230000006698 induction Effects 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 6
- 230000002093 peripheral effect Effects 0.000 claims 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Description
第１図は実施例に係わるイオンプレーテイング
装置の概略説明図である。第２図は誘導電極に印
加される正電圧と二酸化チタン膜の屈折率との関
係を示すグラフである。第３図は従来のイオンプ
レーテイング装置の概略説明図である。
１……真空槽、２……蒸発源、３……蒸発手段
、４……放電手段、５……基板、６……直流バイ
アス印加用部材、１０……正極用誘導電極、１２
……ガス注入用ノズル。
FIG. 1 is a schematic explanatory diagram of an ion plating apparatus according to an embodiment. FIG. 2 is a graph showing the relationship between the positive voltage applied to the induction electrode and the refractive index of the titanium dioxide film. FIG. 3 is a schematic explanatory diagram of a conventional ion plating apparatus. DESCRIPTION OF SYMBOLS 1... Vacuum chamber, 2... Evaporation source, 3... Evaporation means, 4... Discharge means, 5... Substrate, 6... Direct current bias application member, 10... Induction electrode for positive electrode, 12
...Gas injection nozzle.
Claims (1)
と、該蒸発源に配置された蒸発材料を蒸発させる
ための蒸発手段と、蒸発され飛来される上記蒸発
材料をイオン化させるための放電手段と、イオン
化された上記蒸発材料の飛来方向に配置された基
板と、上記蒸発材料の飛来方向に対して上記基板
の背面側に配置された直流バイアス印加用部材と
、をもつイオンプレーテイング装置において、 上記真空槽の内側周面側に正極用誘導電極を設
けて、上記イオン化された蒸発材料が上記基板方
向に誘導されることを特徴とするイオンプレーテ
イング装置。 (2) 基板は基板ホルダーに保持され、上記基板
および上記基板ホルダーは他の部分と電気的に孤
立して真空槽内に保持され、バイアス印加用部材
は負電位に印加され上記真空槽内に保持される構
成である実用新案登録請求の範囲第１項記載のイ
オンプレーテイング装置。[Claims for Utility Model Registration] (1) A vacuum chamber, an evaporation source disposed in the vacuum chamber, an evaporation means for evaporating an evaporation material disposed in the evaporation source, and a evaporation material that is evaporated and blown. a discharge means for ionizing the evaporation material; a substrate disposed in the direction in which the ionized evaporation material flies; and a DC bias application device disposed on the back side of the substrate with respect to the direction in which the evaporation material flies. An ion plating apparatus having a member, wherein a positive induction electrode is provided on the inner peripheral surface side of the vacuum chamber, and the ionized evaporation material is guided toward the substrate. Device. (2) The substrate is held in a substrate holder, the substrate and the substrate holder are electrically isolated from other parts and held in a vacuum chamber, and the bias applying member is applied with a negative potential and placed in the vacuum chamber. The ion plating apparatus according to claim 1, which is a configuration in which the ion plating apparatus is maintained as a utility model.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987175515U JPH0183063U (en) | 1987-11-17 | 1987-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987175515U JPH0183063U (en) | 1987-11-17 | 1987-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0183063U true JPH0183063U (en) | 1989-06-02 |
Family
ID=31467306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987175515U Pending JPH0183063U (en) | 1987-11-17 | 1987-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0183063U (en) |
-
1987
- 1987-11-17 JP JP1987175515U patent/JPH0183063U/ja active Pending
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