JPH0192135U - - Google Patents

Info

Publication number
JPH0192135U
JPH0192135U JP1987187300U JP18730087U JPH0192135U JP H0192135 U JPH0192135 U JP H0192135U JP 1987187300 U JP1987187300 U JP 1987187300U JP 18730087 U JP18730087 U JP 18730087U JP H0192135 U JPH0192135 U JP H0192135U
Authority
JP
Japan
Prior art keywords
capillary
wire bonding
support
electrode
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987187300U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987187300U priority Critical patent/JPH0192135U/ja
Publication of JPH0192135U publication Critical patent/JPH0192135U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例に係るワイヤボンデ
イング装置の使用状態を示す斜視図、第２図は支
持体を断面で示した同装置の拡大部分側面図、第
３図イ，ロ，ハ，ニはそれぞれガイドピン回転動
作説明図、第４図は従来のワイヤボンデイング装
置の説明図、第５図は従来のワイヤボンデイング
装置でワイヤボンデイングした場合の金属細線の
状態を示す平面図である。 ２……キヤピラリ、３……金属細線、４……基
板、５……半導体ペレツト、６……リード、７…
…ガイドピン、８……支持体、

Claims (1)

  1. 【実用新案登録請求の範囲】 基板上にマウントした半導体ペレツトの電極と
    その近傍に配されたリードとをキヤピラリを用い
    て金属細線でワイヤボンデイングする装置におい
    て、 上記キヤピラリの近傍に上記キヤピラリと連動
    する支持体を設け、ピン下部が互いに交叉、離反
    するように回動する一対のガイドピンを上記支持
    体より下方に突出させて取着したことを特徴とす
    るワイヤボンデイング装置。
JP1987187300U 1987-12-09 1987-12-09 Pending JPH0192135U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987187300U JPH0192135U (ja) 1987-12-09 1987-12-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987187300U JPH0192135U (ja) 1987-12-09 1987-12-09

Publications (1)

Publication Number Publication Date
JPH0192135U true JPH0192135U (ja) 1989-06-16

Family

ID=31478464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987187300U Pending JPH0192135U (ja) 1987-12-09 1987-12-09

Country Status (1)

Country Link
JP (1) JPH0192135U (ja)

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