JPH0195760U - - Google Patents

Info

Publication number
JPH0195760U
JPH0195760U JP1987192376U JP19237687U JPH0195760U JP H0195760 U JPH0195760 U JP H0195760U JP 1987192376 U JP1987192376 U JP 1987192376U JP 19237687 U JP19237687 U JP 19237687U JP H0195760 U JPH0195760 U JP H0195760U
Authority
JP
Japan
Prior art keywords
tab
protrusion
outer frame
semiconductor chip
lead patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987192376U
Other languages
English (en)
Japanese (ja)
Other versions
JP2529366Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987192376U priority Critical patent/JP2529366Y2/ja
Publication of JPH0195760U publication Critical patent/JPH0195760U/ja
Application granted granted Critical
Publication of JP2529366Y2 publication Critical patent/JP2529366Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987192376U 1987-12-17 1987-12-17 半導体装置 Expired - Lifetime JP2529366Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987192376U JP2529366Y2 (ja) 1987-12-17 1987-12-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987192376U JP2529366Y2 (ja) 1987-12-17 1987-12-17 半導体装置

Publications (2)

Publication Number Publication Date
JPH0195760U true JPH0195760U (cs) 1989-06-26
JP2529366Y2 JP2529366Y2 (ja) 1997-03-19

Family

ID=31483238

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987192376U Expired - Lifetime JP2529366Y2 (ja) 1987-12-17 1987-12-17 半導体装置

Country Status (1)

Country Link
JP (1) JP2529366Y2 (cs)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612360U (cs) * 1979-07-04 1981-02-02
JPS5895657U (ja) * 1981-12-23 1983-06-29 日本電気株式会社 集積回路用リ−ドフレ−ム
JPS58143541A (ja) * 1982-02-22 1983-08-26 Hitachi Ltd 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612360U (cs) * 1979-07-04 1981-02-02
JPS5895657U (ja) * 1981-12-23 1983-06-29 日本電気株式会社 集積回路用リ−ドフレ−ム
JPS58143541A (ja) * 1982-02-22 1983-08-26 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
JP2529366Y2 (ja) 1997-03-19

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