JPH0195759U - - Google Patents

Info

Publication number
JPH0195759U
JPH0195759U JP1987192375U JP19237587U JPH0195759U JP H0195759 U JPH0195759 U JP H0195759U JP 1987192375 U JP1987192375 U JP 1987192375U JP 19237587 U JP19237587 U JP 19237587U JP H0195759 U JPH0195759 U JP H0195759U
Authority
JP
Japan
Prior art keywords
outer frame
metal
lead
semiconductor chip
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987192375U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987192375U priority Critical patent/JPH0195759U/ja
Publication of JPH0195759U publication Critical patent/JPH0195759U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987192375U 1987-12-17 1987-12-17 Pending JPH0195759U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987192375U JPH0195759U (cs) 1987-12-17 1987-12-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987192375U JPH0195759U (cs) 1987-12-17 1987-12-17

Publications (1)

Publication Number Publication Date
JPH0195759U true JPH0195759U (cs) 1989-06-26

Family

ID=31483237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987192375U Pending JPH0195759U (cs) 1987-12-17 1987-12-17

Country Status (1)

Country Link
JP (1) JPH0195759U (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03169693A (ja) * 1989-11-30 1991-07-23 Toshiba Corp カード状電子機器およびその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612360B2 (cs) * 1976-06-21 1981-03-20
JPS58143541A (ja) * 1982-02-22 1983-08-26 Hitachi Ltd 半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5612360B2 (cs) * 1976-06-21 1981-03-20
JPS58143541A (ja) * 1982-02-22 1983-08-26 Hitachi Ltd 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03169693A (ja) * 1989-11-30 1991-07-23 Toshiba Corp カード状電子機器およびその製造方法

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