JPH0197551U - - Google Patents
Info
- Publication number
- JPH0197551U JPH0197551U JP19544787U JP19544787U JPH0197551U JP H0197551 U JPH0197551 U JP H0197551U JP 19544787 U JP19544787 U JP 19544787U JP 19544787 U JP19544787 U JP 19544787U JP H0197551 U JPH0197551 U JP H0197551U
- Authority
- JP
- Japan
- Prior art keywords
- electrode needle
- wafer
- support frame
- terminal
- pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008188 pellet Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 1
Landscapes
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Description
第１図は本考案の一実施例に係るプローバーの
全体構成図、第２図はウエハ支持枠の斜視図、第
３図は第２図の―線拡大断面図、第４図は裏
面電極針を収容した針収容器の断面図、第５図は
従来のプローバーの構成図、第６図はケルビンコ
ンタクタイプの従来のチヤツクテーブルの平面図
である。
２，７…駆動機構、５…ウエハ支持枠、８…針
収容器、９…裏面電極斜、１１…上部電極針、１
２…プローブカード、Ｗ…ウエハ。
Fig. 1 is an overall configuration diagram of a prober according to an embodiment of the present invention, Fig. 2 is a perspective view of a wafer support frame, Fig. 3 is an enlarged sectional view taken along the line - - of Fig. 2, and Fig. 4 is a back electrode needle. 5 is a configuration diagram of a conventional prober, and FIG. 6 is a plan view of a conventional chuck table of the Kelvin contact type. 2, 7... Drive mechanism, 5... Wafer support frame, 8... Needle container, 9... Back electrode diagonal, 11... Upper electrode needle, 1
2...Probe card, W...wafer.
Claims (1)
た上部電極針との間に、半導体ペレツトが多数形
成されたウエハを支持するウエハ支持枠を水平及
び垂直方向に移動自在に設け、前記ウエハ支持枠
をフオーシング端子、前記裏面電極針をセンシン
グ端子として、ウエハの被検ペレツトの真裏側面
でケルビンコンタクトをとるように構成したこと
を特徴とするプローバー。 A wafer support frame that supports a wafer on which a large number of semiconductor pellets are formed is provided between a back electrode needle that can freely move up and down and an upper electrode needle that is placed directly above it, and is movable in horizontal and vertical directions. A prober characterized in that the supporting frame is used as a facing terminal, the back surface electrode needle is used as a sensing terminal, and Kelvin contact is made on the directly back side of a pellet to be tested on a wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19544787U JPH0414933Y2 (en) | 1987-12-22 | 1987-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19544787U JPH0414933Y2 (en) | 1987-12-22 | 1987-12-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0197551U true JPH0197551U (en) | 1989-06-29 |
| JPH0414933Y2 JPH0414933Y2 (en) | 1992-04-03 |
Family
ID=31486125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19544787U Expired JPH0414933Y2 (en) | 1987-12-22 | 1987-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0414933Y2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012089680A (en) * | 2010-10-20 | 2012-05-10 | Micronics Japan Co Ltd | Semiconductor measuring device |
| JP2012174873A (en) * | 2011-02-21 | 2012-09-10 | Shibasoku:Kk | Test device |
| JP2013120887A (en) * | 2011-12-08 | 2013-06-17 | Mitsubishi Electric Corp | Semiconductor testing device and semiconductor testing method |
| JP2015049137A (en) * | 2013-09-02 | 2015-03-16 | 三菱電機株式会社 | Semiconductor chip testing apparatus and method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012141197A (en) * | 2010-12-28 | 2012-07-26 | Advantest Corp | Test device |
-
1987
- 1987-12-22 JP JP19544787U patent/JPH0414933Y2/ja not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012089680A (en) * | 2010-10-20 | 2012-05-10 | Micronics Japan Co Ltd | Semiconductor measuring device |
| JP2012174873A (en) * | 2011-02-21 | 2012-09-10 | Shibasoku:Kk | Test device |
| JP2013120887A (en) * | 2011-12-08 | 2013-06-17 | Mitsubishi Electric Corp | Semiconductor testing device and semiconductor testing method |
| JP2015049137A (en) * | 2013-09-02 | 2015-03-16 | 三菱電機株式会社 | Semiconductor chip testing apparatus and method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0414933Y2 (en) | 1992-04-03 |