JPH02101540U - - Google Patents

Info

Publication number
JPH02101540U
JPH02101540U JP1989008387U JP838789U JPH02101540U JP H02101540 U JPH02101540 U JP H02101540U JP 1989008387 U JP1989008387 U JP 1989008387U JP 838789 U JP838789 U JP 838789U JP H02101540 U JPH02101540 U JP H02101540U
Authority
JP
Japan
Prior art keywords
capillary
tip
gold wire
transducer
ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989008387U
Other languages
English (en)
Other versions
JPH0536270Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989008387U priority Critical patent/JPH0536270Y2/ja
Publication of JPH02101540U publication Critical patent/JPH02101540U/ja
Application granted granted Critical
Publication of JPH0536270Y2 publication Critical patent/JPH0536270Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図ａ，ｂは本考案のワイヤボンデイング装
置のキヤピラリ取付け構造を示す平面図、側面図
、第２図はワイヤボンデイング装置の一例の主要
部分の構造の概要を示す説明図、第３図ａ，ｂは
従来のワイヤボンデイング装置のトランスデユー
サの構造及びキヤピラリの取付け構造の一例を示
す側面図、平面図、第４図は第３図ｂのトランス
デユーサのキヤピラリ取付け部分の拡大図である
。 １１……トランスデユーサ、１２……キヤピラ
リ、１１３ａ……角穴、１１４……ねじ。なお図
中同一符号は同一または相当するものを示す。

Claims (1)

  1. 【実用新案登録請求の範囲】 トランスデユーサの先端部に取付けられた円筒
    形状にキヤピラリの先端の穴から金線を導出し、
    該金線の先端のトーチで溶融してボールを形成し
    、該ボールを上記キヤピラリが超音波振動を加え
    ながら熱圧着して金線をボンドする構造のワイヤ
    ボンデイング装置において、 上記円筒形状のキヤピラリが上記トランスデユ
    ーサの先端部のすり割り入り角穴に挿入され、上
    記すり割りがねじで締めつけられ、上記キヤピラ
    リがその外周面に上記角穴の内周面が線接触で圧
    接する状態に取付けられていることを特徴とする
    ワイヤボンデイング装置。
JP1989008387U 1989-01-30 1989-01-30 Expired - Lifetime JPH0536270Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989008387U JPH0536270Y2 (ja) 1989-01-30 1989-01-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989008387U JPH0536270Y2 (ja) 1989-01-30 1989-01-30

Publications (2)

Publication Number Publication Date
JPH02101540U true JPH02101540U (ja) 1990-08-13
JPH0536270Y2 JPH0536270Y2 (ja) 1993-09-14

Family

ID=31214221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989008387U Expired - Lifetime JPH0536270Y2 (ja) 1989-01-30 1989-01-30

Country Status (1)

Country Link
JP (1) JPH0536270Y2 (ja)

Also Published As

Publication number Publication date
JPH0536270Y2 (ja) 1993-09-14

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