JPH02102733U - - Google Patents

Info

Publication number
JPH02102733U
JPH02102733U JP1989010210U JP1021089U JPH02102733U JP H02102733 U JPH02102733 U JP H02102733U JP 1989010210 U JP1989010210 U JP 1989010210U JP 1021089 U JP1021089 U JP 1021089U JP H02102733 U JPH02102733 U JP H02102733U
Authority
JP
Japan
Prior art keywords
pad
integrated circuit
insulating film
aluminum wiring
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989010210U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989010210U priority Critical patent/JPH02102733U/ja
Publication of JPH02102733U publication Critical patent/JPH02102733U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例の一部の縦断面図、
第２図はその要部の平面図、第３図は従来の半導
体集積回路装置の一部の縦断面図である。 １……リードフレーム、２……集積回路チツプ
、３……アルミニウム配線、４，５……絶縁膜、
６，６Ａ……ボンデイングパツド、７……パツド
中心部、８……パツド外周部、９……金線、９ａ
……ボール。 FIG. 1 is a longitudinal sectional view of a part of an embodiment of the present invention;
FIG. 2 is a plan view of the main part thereof, and FIG. 3 is a longitudinal sectional view of a part of the conventional semiconductor integrated circuit device. 1... Lead frame, 2... Integrated circuit chip, 3... Aluminum wiring, 4, 5... Insulating film,
6, 6A... Bonding pad, 7... Pad center, 8... Pad outer periphery, 9... Gold wire, 9a
……ball.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 集積回路チツプの内部素子回路に接続されるア
ルミニウム配線上に、絶縁膜を介してボンデイン
グパツドとしてのアルミニウム膜を形成し、この
ボンデイングパツドはボンデイングされる金線の
ボール径よりも小さいパツド中心部と、この外側
に絶縁状態を保つて配置した枠状のパツド外周部
とで構成し、前記パツド中心部を前記絶縁膜に設
けた窓を通して前記アルミニウム配線に電気接続
したことを特徴とする半導体集積回路装置。 An aluminum film as a bonding pad is formed via an insulating film on the aluminum wiring connected to the internal element circuit of the integrated circuit chip. and a frame-shaped pad outer periphery disposed outside the pad in an insulating state, and the center portion of the pad is electrically connected to the aluminum wiring through a window provided in the insulating film. Integrated circuit device.
JP1989010210U 1989-01-31 1989-01-31 Pending JPH02102733U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989010210U JPH02102733U (en) 1989-01-31 1989-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989010210U JPH02102733U (en) 1989-01-31 1989-01-31

Publications (1)

Publication Number Publication Date
JPH02102733U true JPH02102733U (en) 1990-08-15

Family

ID=31217663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989010210U Pending JPH02102733U (en) 1989-01-31 1989-01-31

Country Status (1)

Country Link
JP (1) JPH02102733U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS633822B2 (en) * 1982-09-27 1988-01-26 Mitsubishi Electric Corp

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS633822B2 (en) * 1982-09-27 1988-01-26 Mitsubishi Electric Corp

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