JPH02102740U - - Google Patents

Info

Publication number
JPH02102740U
JPH02102740U JP1103389U JP1103389U JPH02102740U JP H02102740 U JPH02102740 U JP H02102740U JP 1103389 U JP1103389 U JP 1103389U JP 1103389 U JP1103389 U JP 1103389U JP H02102740 U JPH02102740 U JP H02102740U
Authority
JP
Japan
Prior art keywords
frame
resin
chip components
sealing
resin sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1103389U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1103389U priority Critical patent/JPH02102740U/ja
Publication of JPH02102740U publication Critical patent/JPH02102740U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の樹脂封止用枠の実施例を示す
斜視図、第２図は本実施例枠を用いて樹脂封止を
行つた基板の外観を示す斜視図、第３図ａ，ｂは
チツプ部品が実装された基板を示す斜視図及び断
面図、第４図は従来の枠を示す斜視図、第５図ａ
，ｂは従来の枠を用いた樹脂封止を示す断面図、
第６図は従来の枠を用いて樹脂封止を行つた基板
の外観を示す斜視図である。 １……プリント基板、２……配線、３……チツ
プ部品、６……枠部材、７……樹脂、８……連結
部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 基板上に実装された複数のチツプ部品を各々独
    立して樹脂封止するために用いられる樹脂封止用
    枠であつて、前記複数のチツプ部品に対応した複
    数の枠部材を有し各枠部材が連結部を介して平面
    的に一体化されたことを特徴とする樹脂封止用枠
    。
JP1103389U 1989-02-01 1989-02-01 Pending JPH02102740U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1103389U JPH02102740U (ja) 1989-02-01 1989-02-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1103389U JPH02102740U (ja) 1989-02-01 1989-02-01

Publications (1)

Publication Number Publication Date
JPH02102740U true JPH02102740U (ja) 1990-08-15

Family

ID=31219228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1103389U Pending JPH02102740U (ja) 1989-02-01 1989-02-01

Country Status (1)

Country Link
JP (1) JPH02102740U (ja)

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