JPH02104634U - - Google Patents
Info
- Publication number
- JPH02104634U JPH02104634U JP1283089U JP1283089U JPH02104634U JP H02104634 U JPH02104634 U JP H02104634U JP 1283089 U JP1283089 U JP 1283089U JP 1283089 U JP1283089 U JP 1283089U JP H02104634 U JPH02104634 U JP H02104634U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wafer holding
- plating
- fixing jig
- bump plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrolytic Production Of Metals (AREA)
Description
第１図は本考案のウエハ固定治具を示す平面図
、第２図は本考案のウエハ固定治具へのウエハ固
定状態を示す平面図、第３図は第１図のＡ―Ａ′
断面図、第４図は第２図のＢ―Ｂ′断面図、第５
図は従来のバンプめつき方式を示すめつき装置断
面図、第６図は本考案を用いたバンプめつき方式
を示すめつき装置断面図、第７図Ａ，Ｂはコンタ
クト部の他の実施例を示す断面図、第８図Ａ，Ｂ
はウエハ押え部の他の実施例を示す断面図である
。
FIG. 1 is a plan view showing the wafer fixing jig of the present invention, FIG. 2 is a plan view showing the wafer fixed state to the wafer fixing jig of the present invention, and FIG. 3 is A-A' in FIG.
A cross-sectional view, Figure 4 is a cross-sectional view taken along line BB' in Figure 2, and Figure 5.
The figure is a sectional view of a plating device showing a conventional bump plating method, FIG. 6 is a sectional view of a plating device showing a bump plating method using the present invention, and FIGS. 7A and B are other embodiments of the contact part. Cross-sectional view showing an example, Figure 8 A, B
FIG. 3 is a sectional view showing another embodiment of the wafer holding part.
Claims (1)
定治具において、中空円板状の本体の外周に複数
個のめつき装置とのコンタクト部を、内周にウエ
ハとの電気的接続を得るためのコンタクトピンを
有する同数のウエハとのコンタクト部を有し、さ
らに本体上にウエハ押え支持部により支持された
バネ性を有するウエハ押え部とウエハ押え固定ピ
ンを有することを特徴とするバンプめつき用ウエ
ハ固定治具。 In a wafer fixing jig for bump plating on semiconductor devices, a hollow disc-shaped body has a plurality of contact parts for plating equipment on the outer periphery and contacts for electrical connection with the wafer on the inner periphery. A wafer for bump plating, which has a contact part with the same number of wafers having pins, and further has a wafer holding part having spring properties supported by a wafer holding support part on the main body, and a wafer holding fixing pin. fixing jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1283089U JPH02104634U (en) | 1989-02-06 | 1989-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1283089U JPH02104634U (en) | 1989-02-06 | 1989-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02104634U true JPH02104634U (en) | 1990-08-20 |
Family
ID=31222623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1283089U Pending JPH02104634U (en) | 1989-02-06 | 1989-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02104634U (en) |
-
1989
- 1989-02-06 JP JP1283089U patent/JPH02104634U/ja active Pending