JPH0210863B2 - - Google Patents

Info

Publication number
JPH0210863B2
JPH0210863B2 JP60132278A JP13227885A JPH0210863B2 JP H0210863 B2 JPH0210863 B2 JP H0210863B2 JP 60132278 A JP60132278 A JP 60132278A JP 13227885 A JP13227885 A JP 13227885A JP H0210863 B2 JPH0210863 B2 JP H0210863B2
Authority
JP
Japan
Prior art keywords
target
metal
ring
divided pieces
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60132278A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61291968A (ja
Inventor
Kunihiro Matsubara
Takeo Oota
Kazuo Inoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP60132278A priority Critical patent/JPS61291968A/ja
Publication of JPS61291968A publication Critical patent/JPS61291968A/ja
Publication of JPH0210863B2 publication Critical patent/JPH0210863B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Optical Record Carriers (AREA)
JP60132278A 1985-06-18 1985-06-18 スパツタリング用タ−ゲツト Granted JPS61291968A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60132278A JPS61291968A (ja) 1985-06-18 1985-06-18 スパツタリング用タ−ゲツト

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60132278A JPS61291968A (ja) 1985-06-18 1985-06-18 スパツタリング用タ−ゲツト

Publications (2)

Publication Number Publication Date
JPS61291968A JPS61291968A (ja) 1986-12-22
JPH0210863B2 true JPH0210863B2 (fr) 1990-03-09

Family

ID=15077541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60132278A Granted JPS61291968A (ja) 1985-06-18 1985-06-18 スパツタリング用タ−ゲツト

Country Status (1)

Country Link
JP (1) JPS61291968A (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6464844B1 (en) * 2000-09-21 2002-10-15 Delphi Technologies, Inc. Sputtering alloy films using a sintered metal composite target
US6402906B1 (en) 2000-10-19 2002-06-11 Delphi Technologies, Inc. Sputtering alloy films using a crescent-shaped aperture
CN110106487B (zh) * 2019-05-28 2020-07-14 上海交通大学 一种提高靶材使用率的磁控溅射圆形平面靶枪的磁靶

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59193272A (ja) * 1983-04-15 1984-11-01 Daido Steel Co Ltd スパツタリングにおけるタ−ゲツトおよびスパツタリング方法

Also Published As

Publication number Publication date
JPS61291968A (ja) 1986-12-22

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