JPH0211341U - - Google Patents
Info
- Publication number
- JPH0211341U JPH0211341U JP1988090779U JP9077988U JPH0211341U JP H0211341 U JPH0211341 U JP H0211341U JP 1988090779 U JP1988090779 U JP 1988090779U JP 9077988 U JP9077988 U JP 9077988U JP H0211341 U JPH0211341 U JP H0211341U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- insulating film
- conductive film
- film
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の縦断面図、第２図
は本考案の他の実施例の縦断面図、第３図は従来
技術の縦断面図である。 １……それ自体で完全に動作する半導体集積回
路、２，２２……絶縁膜、３……導電体膜、４…
…封止樹脂、５……ボンデイングワイヤ、６……
電源ライン接続部。
は本考案の他の実施例の縦断面図、第３図は従来
技術の縦断面図である。 １……それ自体で完全に動作する半導体集積回
路、２，２２……絶縁膜、３……導電体膜、４…
…封止樹脂、５……ボンデイングワイヤ、６……
電源ライン接続部。
Claims (1)
- 半導体基板表面に形成された集積回路と、該集
積回路上に設けられた絶縁膜と、前記集積回路の
外部への接続のための領域以外の前記絶縁膜上に
設けられ、所定の固定電位が与えられる導電体膜
と、前記絶縁膜及び前記導電体膜を覆つて設けら
れた樹脂とを有することを特徴とする半導体集積
回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988090779U JPH0211341U (ja) | 1988-07-07 | 1988-07-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988090779U JPH0211341U (ja) | 1988-07-07 | 1988-07-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0211341U true JPH0211341U (ja) | 1990-01-24 |
Family
ID=31315291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988090779U Pending JPH0211341U (ja) | 1988-07-07 | 1988-07-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0211341U (ja) |
-
1988
- 1988-07-07 JP JP1988090779U patent/JPH0211341U/ja active Pending