JPH01100443U - - Google Patents

Info

Publication number
JPH01100443U
JPH01100443U JP1987195704U JP19570487U JPH01100443U JP H01100443 U JPH01100443 U JP H01100443U JP 1987195704 U JP1987195704 U JP 1987195704U JP 19570487 U JP19570487 U JP 19570487U JP H01100443 U JPH01100443 U JP H01100443U
Authority
JP
Japan
Prior art keywords
semiconductor device
insulating resin
electrode
groove
covers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987195704U
Other languages
English (en)
Other versions
JPH06821Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987195704U priority Critical patent/JPH06821Y2/ja
Publication of JPH01100443U publication Critical patent/JPH01100443U/ja
Application granted granted Critical
Publication of JPH06821Y2 publication Critical patent/JPH06821Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案における半導体装置の実装構造
を示す平面図、第２図ａ〜ｃは本考案における第
１の実施例における構成を得るための工程を説明
する第１図のＡ―Ａ断面図、第２図ｄは第２図ｃ
に対応する斜視図、第３図ａ〜ｃは本考案におけ
る第２の実施例における構成を得るための工程を
説明する断面図、第４図は従来例における半導体
装置の実装構造を示す断面図、第５図および第６
図はいずれも従来例における半導体装置の実装構
造を示す平面図である。 １……半導体装置（ＩＣ）、３……絶縁樹脂、
４……導体、５……プラスチツク保護板、９……
凹溝。

Claims (1)

    【実用新案登録請求の範囲】
  1. 電極部分のみが露出するように半導体装置を覆
    う絶縁樹脂と、前記電極に対応して前記絶縁樹脂
    に設ける凹溝と、該凹溝に形成する導体とからな
    ることを特徴とする半導体装置の実装構造。
JP1987195704U 1987-12-25 1987-12-25 半導体装置の実装構造 Expired - Lifetime JPH06821Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987195704U JPH06821Y2 (ja) 1987-12-25 1987-12-25 半導体装置の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987195704U JPH06821Y2 (ja) 1987-12-25 1987-12-25 半導体装置の実装構造

Publications (2)

Publication Number Publication Date
JPH01100443U true JPH01100443U (ja) 1989-07-05
JPH06821Y2 JPH06821Y2 (ja) 1994-01-05

Family

ID=31486366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987195704U Expired - Lifetime JPH06821Y2 (ja) 1987-12-25 1987-12-25 半導体装置の実装構造

Country Status (1)

Country Link
JP (1) JPH06821Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011009408A (ja) * 2009-06-25 2011-01-13 Ricoh Co Ltd 電子部品モジュール及び製造方法
JP2018093221A (ja) * 2016-09-26 2018-06-14 株式会社パウデック 半導体パッケージ、モジュールおよび電気機器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4834674A (ja) * 1971-09-09 1973-05-21
JPS61220346A (ja) * 1985-03-26 1986-09-30 Toshiba Corp 半導体装置とその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4834674A (ja) * 1971-09-09 1973-05-21
JPS61220346A (ja) * 1985-03-26 1986-09-30 Toshiba Corp 半導体装置とその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011009408A (ja) * 2009-06-25 2011-01-13 Ricoh Co Ltd 電子部品モジュール及び製造方法
JP2018093221A (ja) * 2016-09-26 2018-06-14 株式会社パウデック 半導体パッケージ、モジュールおよび電気機器

Also Published As

Publication number Publication date
JPH06821Y2 (ja) 1994-01-05

Similar Documents

Publication Publication Date Title
JPH01100443U (ja)
JPH0438063U (ja)
JPH0176040U (ja)
JPS61140574U (ja)
JPS6234441U (ja)
JPH0451145U (ja)
JPS63128745U (ja)
JPH0242445U (ja)
JPS61182036U (ja)
JPH0270459U (ja)
JPS61111160U (ja)
JPS6252946U (ja)
JPS62151748U (ja)
JPH0211341U (ja)
JPS6230341U (ja)
JPH02114941U (ja)
JPS6175130U (ja)
JPH02146437U (ja)
JPS6228451U (ja)
JPH01107155U (ja)
JPH02102734U (ja)
JPS61183540U (ja)
JPH03117928U (ja)
JPS6236535U (ja)
JPH01130548U (ja)