JPS6236535U - - Google Patents

Info

Publication number
JPS6236535U
JPS6236535U JP1985127619U JP12761985U JPS6236535U JP S6236535 U JPS6236535 U JP S6236535U JP 1985127619 U JP1985127619 U JP 1985127619U JP 12761985 U JP12761985 U JP 12761985U JP S6236535 U JPS6236535 U JP S6236535U
Authority
JP
Japan
Prior art keywords
extraction electrode
bonding wire
semiconductor
semiconductor chip
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985127619U
Other languages
English (en)
Other versions
JPH0416437Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985127619U priority Critical patent/JPH0416437Y2/ja
Publication of JPS6236535U publication Critical patent/JPS6236535U/ja
Application granted granted Critical
Publication of JPH0416437Y2 publication Critical patent/JPH0416437Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図Ａは本考案の実施例の平面図、Ｂはその
Ａ―Ａ′線断面図、第２図及び第３図は本考案の
他の実施例を夫々示す平面図、第４図Ａは従来の
半導体回路装置の平面図、ＢはそのＡ―Ａ′線断
面図、第５図は従来例の他の装置の平面図である
。 主要部分の符号の説明、４，５……引出し電極
、６……チツプ、９……ボンデイングランド用導
体パターン、１０……ボンデイングワイヤ、１１
……絶縁基板。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チツプと、半導体パツケージの引出し電
    極と、前記半導体チツプと前記引出し電極との間
    を中継接続するためのボンデイングワイヤとを含
    む半導体回路装置であつて、前記ボンデイングワ
    イヤのためのボンデイングランド用導体パターン
    が前記引出し電極設置用基板と同一基板上に形成
    されていることを特徴とする半導体回路装置。
JP1985127619U 1985-08-21 1985-08-21 Expired JPH0416437Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985127619U JPH0416437Y2 (ja) 1985-08-21 1985-08-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985127619U JPH0416437Y2 (ja) 1985-08-21 1985-08-21

Publications (2)

Publication Number Publication Date
JPS6236535U true JPS6236535U (ja) 1987-03-04
JPH0416437Y2 JPH0416437Y2 (ja) 1992-04-13

Family

ID=31022543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985127619U Expired JPH0416437Y2 (ja) 1985-08-21 1985-08-21

Country Status (1)

Country Link
JP (1) JPH0416437Y2 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122763A (ja) * 1982-01-14 1983-07-21 Toshiba Corp 樹脂封止型半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122763A (ja) * 1982-01-14 1983-07-21 Toshiba Corp 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPH0416437Y2 (ja) 1992-04-13

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