JPH02114942U - - Google Patents

Info

Publication number
JPH02114942U
JPH02114942U JP1989022242U JP2224289U JPH02114942U JP H02114942 U JPH02114942 U JP H02114942U JP 1989022242 U JP1989022242 U JP 1989022242U JP 2224289 U JP2224289 U JP 2224289U JP H02114942 U JPH02114942 U JP H02114942U
Authority
JP
Japan
Prior art keywords
mounting board
semiconductor chip
ceramic film
region
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989022242U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989022242U priority Critical patent/JPH02114942U/ja
Publication of JPH02114942U publication Critical patent/JPH02114942U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の第１実施例の縦断面図、第２
図は本考案の第２実施例の縦断面図である。 １……実装基板、２……導体膜、３，３Ａ……
セラミツク膜、４……半導体チツプ、５……金ワ
イヤ、６……モールド材。

Claims (1)

    【実用新案登録請求の範囲】
  1. 実装基板上に直接半導体チツプを搭載する半導
    体装置において、前記実装基板には少なくとも前
    記半導体チツプを搭載する領域の表面にセラミツ
    ク膜を形成したことを特徴とする半導体装置。
JP1989022242U 1989-02-28 1989-02-28 Pending JPH02114942U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989022242U JPH02114942U (ja) 1989-02-28 1989-02-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989022242U JPH02114942U (ja) 1989-02-28 1989-02-28

Publications (1)

Publication Number Publication Date
JPH02114942U true JPH02114942U (ja) 1990-09-14

Family

ID=31240181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989022242U Pending JPH02114942U (ja) 1989-02-28 1989-02-28

Country Status (1)

Country Link
JP (1) JPH02114942U (ja)

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