JPH0235443U - - Google Patents
Info
- Publication number
- JPH0235443U JPH0235443U JP1988112885U JP11288588U JPH0235443U JP H0235443 U JPH0235443 U JP H0235443U JP 1988112885 U JP1988112885 U JP 1988112885U JP 11288588 U JP11288588 U JP 11288588U JP H0235443 U JPH0235443 U JP H0235443U
- Authority
- JP
- Japan
- Prior art keywords
- solder material
- semiconductor device
- metal base
- fixed
- convex part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
Landscapes
- Microwave Amplifiers (AREA)
- Wire Bonding (AREA)
- Waveguides (AREA)
Description
第１図ａ，ｂは本考案の一実施例による半導体
装置を示す上面図および断面正面図、第２図ａ，
ｂは従来の半導体装置の上面図および正面断面図
である。 図において、１は金属基体、２は平面回路基板
、３ａ，３ｂ，３ｃは平面回路を構成する金属薄
膜、４は半導体チツプ、５は半田材、７は金属細
線、８はキヤパシタである。なお、図中、同一符
号は同一、または相当部分を示す。
装置を示す上面図および断面正面図、第２図ａ，
ｂは従来の半導体装置の上面図および正面断面図
である。 図において、１は金属基体、２は平面回路基板
、３ａ，３ｂ，３ｃは平面回路を構成する金属薄
膜、４は半導体チツプ、５は半田材、７は金属細
線、８はキヤパシタである。なお、図中、同一符
号は同一、または相当部分を示す。
Claims (1)
- 半導体チツプ、整合基板が金属基体に半田材に
て固着されている半導体装置において、前記金属
基体の一部に凸部を設け、前記整合基板の端面を
前記凸部に密着させて半田材で固着し、前記半田
材を整合基板表面へしみ出させ短絡回路を形成し
たことを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988112885U JPH0235443U (ja) | 1988-08-29 | 1988-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988112885U JPH0235443U (ja) | 1988-08-29 | 1988-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0235443U true JPH0235443U (ja) | 1990-03-07 |
Family
ID=31352232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988112885U Pending JPH0235443U (ja) | 1988-08-29 | 1988-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0235443U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0992955A (ja) * | 1995-07-18 | 1997-04-04 | Mitsubishi Electric Corp | 電子装置 |
| JP2000091802A (ja) * | 1998-09-11 | 2000-03-31 | Matsushita Electric Ind Co Ltd | マイクロ波回路 |
-
1988
- 1988-08-29 JP JP1988112885U patent/JPH0235443U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0992955A (ja) * | 1995-07-18 | 1997-04-04 | Mitsubishi Electric Corp | 電子装置 |
| JP2000091802A (ja) * | 1998-09-11 | 2000-03-31 | Matsushita Electric Ind Co Ltd | マイクロ波回路 |